component
π110M30
Public Made by Adomby adom
2Pai Semi Pre-ordered Products, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownπ110M30
2Pai Semi · Pre-ordered Products · SOIC-8
π110M30 from 2Pai Semi, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD1 | power_in | Supply Voltage for Isolator Side 1, which must operate between 3.0 V and 5.5 V per the recommended operating conditions. |
| 2 | VIN | power_in | Logic Input for the channel, which must not exceed VDD1 + 0.5 V per the absolute maximum input voltage rating. |
| 3 | VDD1 | power_in | Supply Voltage for Isolator Side 1, which must operate between 3.0 V and 5.5 V per the recommended operating conditions. |
| 4 | GND1 | power_in | Ground 1, the ground reference for Isolator Side 1. |
| 5 | GND2 | power_in | Ground 2, the ground reference for Isolator Side 2. |
| 6 | VOUT | output | Logic Output for the channel; for the π110M30 variant the output defaults to Low when the input side is unpowered or the input is open. |
| 7 | GND2 | power_in | Ground 2, the ground reference for Isolator Side 2. |
| 8 | VDD2 | power_in | Supply Voltage for Isolator Side 2, which must operate between 3.0 V and 5.5 V per the recommended operating conditions. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | 2Pai Semi |
| Package | SOIC-8 |
| Category | Electronic Tools/Instruments/Consumables |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VDDx | 3 | 5.5 | V | 2 | ||
| Supply Voltages (VDD1-GND1, VDD2-GND2) | -0.5 | 7 | V | 2 | |||
| Ambient Operating Temperature (TA) | TA | -40 | 125 | °C | 2 | ||
| Ambient Operating Temperature (TA) Range | TA | -40 | 125 | °C | 2 | ||
| Junction Temperature | TJ | -40 | 150 | °C | 2 | ||
| Storage Temperature (TST) Range | TST | -65 | 150 | °C | 2 | ||
| Common-Mode Transients Immunity | -200 | 200 | kV/µs | 2 | |||
| Average Output Current per Pin, Side 1 Output Current | IO1 | -10 | 10 | mA | 2 | ||
| Average Output Current per Pin, Side 2 Output Current | IO2 | -10 | 10 | mA | 2 | ||
| Data Rate | 0 | 10 | Mbps | 2 | |||
| Minimum Pulse Width | PW | 100 | ns | Within pulse width distortion (PWD) limit | 3 | ||
| Propagation Delay Time (5 V operation) | tpHL, tpLH | 5.5 | 8 | 12.5 | ns | @ 5VDC supply | 3 |
| Propagation Delay Time (3.3 V operation) | tpHL, tpLH | 6.5 | 9 | 13.5 | ns | @ 3.3VDC supply | 3 |
| Pulse Width Distortion (5 V) | PWD | 0 | 0.3 | 3 | ns | @ 5VDC supply; /tpHL - tpLH/ | 3 |
| Pulse Width Distortion (3.3 V) | PWD | 0 | 0.3 | 3 | ns | @ 3.3VDC supply; /tpHL - tpLH/ | 3 |
| Common-Mode Transient Immunity | CMTI | 75 | kV/µs | VIN = VDDx2 or 0V, VCM = 1000 V | 3 | ||
| ESD (HBM - Human body model) | ESD | -8 | 8 | kV | Human body model (HBM), ±8 kV as printed | 3 | |
| VDDx1 Undervoltage Rising Threshold | VDDxUV+ | 2.45 | 2.75 | 2.95 | V | 4 | |
| VDDx1 Undervoltage Falling Threshold | VDDxUV− | 2.3 | 2.6 | 2.75 | V | 4 | |
| Input Current per Signal Channel | IIN | -10 | 0.5 | 10 | µA | 0 V ≤ Signal voltage ≤ VDDX1 | 4 |
| Low Level Output Voltage (20 µA output current) | VOL | 0 | 0.1 | V | 20 µA output current | 4 | |
| Low Level Output Voltage (2 mA output current) | VOL | 0.1 | 0.2 | V | 2 mA output current | 4 | |
| Quiescent Supply Current IDD1 (5 VDC, VI=0V for π110M30) | IDD1 (Q) | 0.06 | 0.08 | 0.1 | mA | 5VDC supply, VI=0V, CL=0 pF, TA=25°C | 4 |
| Quiescent Supply Current IDD1 (5 VDC, VI=5V for π110M30) | IDD1 (Q) | 0.15 | 0.19 | 0.25 | mA | 5VDC supply, VI=5V, CL=0 pF, TA=25°C | 4 |
| Quiescent Supply Current IDD1 (3.3 VDC, VI=0V for π110M30) | IDD1 (Q) | 0.06 | 0.08 | 0.1 | mA | 3.3VDC supply, VI=0V, CL=0 pF, TA=25°C | 4 |
| Quiescent Supply Current IDD1 (3.3 VDC, VI=3.3V for π110M30) | IDD1 (Q) | 0.11 | 0.14 | 0.18 | mA | 3.3VDC supply, VI=3.3V, CL=0 pF, TA=25°C | 4 |
| Rated Dielectric Insulation Voltage | 3000 | V rms | 1-minute duration | 4 | |||
| Minimum External Air Gap (Clearance) | L (CLR) | 4 | mm | Measured from input terminals to output terminals, shortest distance through air | 4 | ||
| Minimum External Tracking (Creepage) | L (CRP) | 4 | mm | Measured from input terminals to output terminals, shortest distance path along body | 4 | ||
| Minimum Internal Gap (Internal Clearance) | 11 | µm | Insulation distance through insulation | 4 | |||
| Tracking Resistance (Comparative Tracking Index) | CTI | 400 | V | DIN EN 60112 (VDE 0303-11):2010-05, IEC 60112:2003 + A1:2009 | 4 | ||
| Resistance (Input to Output) | RIO | 1011 | Ω | 5 | |||
| Capacitance (Input to Output) | CIO | 0.6 | pF | @1MHz | 5 | ||
| Input Capacitance | CI | 3 | pF | @1MHz | 5 | ||
| IC Junction to Ambient Thermal Resistance | θJA | 100 | °C/W | Thermocouple located at center of package underside | 5 | ||
| Maximum Safety Temperature | TS | 150 | °C | Maximum value allowed in the event of a failure (see Figure 4) | 6 | ||
| Maximum Power Dissipation at 25°C | PS | 1.25 | W | Maximum value allowed in the event of a failure (see Figure 4) | 6 | ||
| Maximum repetitive peak isolation voltage | VIORM | 565 | Vpeak | DIN VDE V 0884-11 Basic insulation | 4 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | pC | In accordance with DIN V VDE V 0884-11, each π110M3x is proof tested by applying an insulation test voltage ≥ 848V peak for 1 sec (partial discharge detection limit = 5 pC). | 5 |
CAD (KiCad official)
- Symbol:
π110M30 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
110m30-etched.step/110m30-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);110m30.step/110m30.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: 2Pai Semi datasheet (12 pp, sha256
d00e887193e90357, retrieved 2026-10-27, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusoff(skipped (clean text read)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).