# 10BQ060

**SMC Sangdest Microelectronicstronic Nanjing** · Schottky Diodes · SMB(DO-214AA)

10BQ060 from SMC Sangdest Microelectronicstronic Nanjing, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | SMC Sangdest Microelectronicstronic Nanjing |
| Package | SMB(DO-214AA) |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak Repetitive Reverse Voltage / Working Peak Reverse Voltage / DC Blocking Voltage | VRRM / VRWM / VR |  |  | 60 | V |  | 1 |
| Average Rectified Forward Current | IF (AV) |  |  | 1 | A | 50% duty cycle @TC =103°C, rectangular wave form | 1 |
| Peak One Cycle Non-Repetitive Surge Current | IFSM |  |  | 50 | A | 8.3 ms, half Sine pulse, TC =25°C | 1 |
| Forward Voltage Drop (1 A, TJ = 25 °C) | VF1 |  | 0.55 | 0.6 | V | @ 1 A, Pulse, TJ = 25 °C | 1 |
| Forward Voltage Drop (2 A, TJ = 25 °C) | VF1 |  | 0.67 | 0.76 | V | @ 2 A, Pulse, TJ = 25 °C | 1 |
| Forward Voltage Drop (1 A, TJ = 125 °C) | VF2 |  | 0.48 | 0.57 | V | @ 1 A, Pulse, TJ = 125 °C | 1 |
| Forward Voltage Drop (2 A, TJ = 125 °C) | VF2 |  | 0.6 | 0.69 | V | @ 2 A, Pulse, TJ = 125 °C | 1 |
| Reverse Current (TJ = 25 °C) | IR1 |  | 0.01 | 1 | mA | @VR = Rated VR, Pulse, TJ = 25 °C | 1 |
| Reverse Current (TJ = 125 °C) | IR2 |  | 5 | 10 | mA | @VR = Rated VR, Pulse, TJ = 125 °C | 1 |
| Junction Capacitance | CT |  | 45 | 62 | pF | @VR = 5V, TC = 25 °C, fSIG = 1MHz | 1 |
| Series Inductance | LS |  | 2 |  | nH | Measured lead to lead 5 mm from package body | 1 |
| Voltage Rate of Change | dv/dt |  |  | 10000 | V/s |  | 1 |
| Junction Temperature | TJ | -55 |  | 150 | C |  | 2 |
| Storage Temperature | Tstg | -55 |  | 150 | C |  | 2 |
| Typical Thermal Resistance Junction to Lead | RJL |  | 36 |  | C/W |  | 2 |

## CAD (KiCad official)

- Symbol: `10BQ060`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
- 3D model files: `10bq060-etched.step` / `10bq060-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `10bq060.step` / `10bq060.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [SMC Sangdest Microelectronicstronic Nanjing datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588902574926016512) (4 pp, sha256 `76ca0e9b848ba072`, retrieved 2026-10-16, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/10bq060-datasheet.pdf)