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Contents

README

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10BQ030

SMC(Sangdest Microelectronicstronic (Nanjing)) · Schottky Barrier Diodes (SBD) · SMB(DO-214AA)

10BQ030 from SMC(Sangdest Microelectronicstronic (Nanjing)), in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer SMC(Sangdest Microelectronicstronic (Nanjing))
Package SMB(DO-214AA)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage / Working Peak Reverse Voltage / DC Blocking Voltage VRRM/VRWM/VR 30 V 1
Average Rectified Forward Current IF(AV) 1 A 50% duty cycle @TC =100°C, rectangular wave form 1
Peak One Cycle Non-Repetitive Surge Current IFSM 108 A 8.3 ms, half Sine pulse, TC =25°C 1
Forward Voltage Drop VF1 0.38 0.42 V @ 1 A, Pulse, TJ = 25 °C 1
Forward Voltage Drop VF1 0.43 0.47 V @ 2 A, Pulse, TJ = 25 °C 1
Forward Voltage Drop VF2 0.27 0.32 V @ 1 A, Pulse, TJ = 125 °C 1
Forward Voltage Drop VF2 0.32 0.37 V @ 2 A, Pulse, TJ = 125 °C 1
Reverse Current IR1 0.02 1 mA @VR = Rated VR, Pulse, TJ = 25 °C 1
Reverse Current IR2 12 15 mA @VR = Rated VR, Pulse, TJ = 125 °C 1
Junction Capacitance CT 190 200 pF @VR = 5V, TC = 25 °C, fSIG = 1MHz 1
Series Inductance LS 2 nH Measured lead to lead 5 mm from package body 1
Voltage Rate of Change dv/dt 10000 V/s 1
Junction Temperature TJ -55 150 C 2
Storage Temperature Tstg -55 150 C 2
Typical Thermal Resistance Junction to Lead RJL 25 C/W 2

CAD (KiCad official)

  • Symbol: 10BQ030
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
  • 3D model files: 10bq030-etched.step / 10bq030-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 10bq030.step / 10bq030.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SMC(Sangdest Microelectronicstronic (Nanjing)) datasheet (4 pp, sha256 7d5cea982ef026b7, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF