component
1.5SMC51AQ
Public Made by Adomby adom
Yangzhou Yangjie Elec Tech ESD And Surge Protection (TVS/ESD), DO-214AB(SMC). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdown1.5SMC51AQ
Yangzhou Yangjie Elec Tech · ESD And Surge Protection (TVS/ESD) · DO-214AB(SMC)
1.5SMC51AQ from Yangzhou Yangjie Elec Tech, in a DO-214AB(SMC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Yangzhou Yangjie Elec Tech |
| Package | DO-214AB(SMC) |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown voltage (min) | VBR | 48.45 | V | IT = 1 mA (pulse test tp≤50ms) | 2 | ||
| Breakdown voltage (max) | VBR | 53.55 | V | IT = 1 mA (pulse test tp≤50ms) | 2 | ||
| Maximum reverse leakage current | IR | 1 | μA | @ VRWM = 43.6 V | 2 | ||
| Working peak reverse voltage | VRWM | 43.6 | V | 2 | |||
| Maximum reverse surge current | IPP | 21.4 | A | 2 | |||
| Maximum clamping voltage | VC | 70.1 | V | @ IPP | 2 | ||
| Peak power dissipation | PPPM | 1500 | W | with a 10/1000us waveform | 1 | ||
| Power dissipation | PD | 6.5 | W | on infinite heat sink at TL=75℃ | 1 | ||
| Peak forward surge current | IFSM | 200 | A | 8.3 ms single half sine-wave; unidirectional only | 1 | ||
| Operating junction temperature | TJ | -55 | 175 | ℃ | 1 | ||
| Storage temperature range | TSTG | -55 | 175 | ℃ | 1 | ||
| Thermal resistance junction to ambient | RθJ-A | 75 | ℃/W | junction to ambient; mounted on minimum recommended pad layout (note 7) | 3 | ||
| Thermal resistance junction to lead | RθJ-L | 15 | ℃/W | junction to lead | 3 |
CAD (KiCad official)
- Symbol:
1.5SMC51AQ - Footprint:
Diode_SMD:D_SMC - 3D model: DO-214AB(SMC) (KiCad packages3D, STEP)
- 3D model files:
1-5smc51aq-etched.step/1-5smc51aq-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);1-5smc51aq.step/1-5smc51aq.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Yangzhou Yangjie Elec Tech datasheet (6 pp, sha256
5eff5ad2ffe8201b, retrieved 2026-10-15, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).