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1.5SMC12CA M6G

Taiwan Semiconductor(Taiwan Semicon) · TVS · DO-214AB(SMC)

1.5SMC12CA M6G from Taiwan Semiconductor(Taiwan Semicon), in a DO-214AB(SMC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Taiwan Semiconductor(Taiwan Semicon)
Package DO-214AB(SMC)
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown voltage VBR 11.4 12.6 V IT=1 mA 2
Maximum blocking leakage current IR 1 µA @VWM=10.2 V 2
Maximum peak impulse current IPPM 94 A Surge waveform per Fig. 3 (note 2) 2
Maximum clamping voltage VC 16.7 V @IPPM 2
Maximum temperature coefficient of VBR 0.078 %/°C 2
Peak power dissipation PPK 1500 W TA=25°C, tp=1ms (note 1) 1
Steady state power dissipation PD 6.5 W TA=25°C 1
Peak forward surge current IFSM 200 A 8.3 ms single half sine-wave 1
Junction temperature TJ -55 150 °C 1
Storage temperature TSTG -55 150 °C 1
Junction-to-ambient thermal resistance RӨJA 50 °C/W 2
Junction-to-case thermal resistance RӨJC 15 °C/W 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin ● Terminal:Matte tin plated leads, solderable per J-STD-002 ● Meet JESD 201 class 2 whisker test 1

CAD (KiCad official)

  • Symbol: 1.5SMC12CA M6G
  • Footprint: Diode_SMD:D_SMC
  • 3D model: DO-214AB(SMC) (KiCad packages3D, STEP)
  • 3D model files: 1-5smc12ca-m6g-etched.step / 1-5smc12ca-m6g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 1-5smc12ca-m6g.step / 1-5smc12ca-m6g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Taiwan Semiconductor(Taiwan Semicon) datasheet (8 pp, sha256 d3e6e50f04c93642, retrieved 2026-11-02, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF