component
1.5SMBJ75CA
Public Made by Adomby adom
BORN ESD And Surge Protection (TVS/ESD), DO-214AA(SMB). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdown1.5SMBJ75CA
BORN · ESD And Surge Protection (TVS/ESD) · DO-214AA(SMB)
1.5SMBJ75CA from BORN, in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | BORN |
| Package | DO-214AA(SMB) |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown Voltage VBR (min) | VBR | 83.3 | V | VBR@IT, IT = 1 mA (1.5SMBJ75CA row) | 4 | ||
| Breakdown Voltage VBR (max) | VBR | 92.1 | V | VBR@IT, IT = 1 mA (1.5SMBJ75CA row) | 4 | ||
| Maximum Clamping Voltage | VC | 121 | V | VC @ Ipp = 12.4 A | 4 | ||
| Maximum Peak Pulse Current | Ipp | 12.4 | A | 4 | |||
| Maximum Reverse Leakage Current | IR | 1 | uA | IR @VR (reverse stand-off 75 V row) | 4 | ||
| Peak Pulse Power Dissipation | PPPM | 1500 | W | Non-repetitive 10/1000us waveform (Note 1,2) | 2 | ||
| Steady State Power Dissipation | PD | 5 | W | Infinite heatsink at TA=50◦C (Note 3) | 2 | ||
| Peak Forward Surge Current | IFSM | 150 | A | 8.3ms single half sine wave or equivalent square wave, duty cycle=4 per minute maximum (Note 4) | 2 | ||
| Typical Thermal Resistance Junction to Lead | RθJL | 20 | ◦C/W | 2 | |||
| Typical Thermal Resistance Junction to Ambient | RθJA | 100 | ◦C/W | 2 | |||
| Operating Temperature Range | TJ | -55 | 150 | ◦C | 2 | ||
| Storage Temperature Range | TSTG | -55 | 150 | ◦C | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | • Lead Finish: Matte Tin • Case Material: Epoxy Molding Compound | 1 |
CAD (KiCad official)
- Symbol:
1.5SMBJ75CA - Footprint:
Diode_SMD:D_SMB - 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
- 3D model files:
1-5smbj75ca-etched.step/1-5smbj75ca-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);1-5smbj75ca.step/1-5smbj75ca.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: BORN datasheet (7 pp, sha256
62ec162cfcc3666d, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).