component

1.5SMBJ30CA

Public Made by Adom

by adom

BORN TVS, DO-214AA(SMB). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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1.5SMBJ30CA

BORN · TVS · DO-214AA(SMB)

1.5SMBJ30CA from BORN, in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised fuse; either orientation.
2 2 passive Terminal 2 of an unpolarised fuse; either orientation.

Key specifications

Parameter Value
Manufacturer BORN
Package DO-214AA(SMB)
Category TVS/Fuse/Board Level Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown Voltage (VBR), bidirectional 30CA, min VBR 33.3 V IT = 1 mA 3
Breakdown Voltage (VBR), bidirectional 30CA, max VBR 36.8 V IT = 1 mA 3
Reverse Stand-Off Voltage (VR) VR 30 V 3
Maximum Clamping Voltage (VC) VC 48.4 V At Ipp = 31.0 A 3
Maximum Peak Pulse Current (Ipp) Ipp 31 A 3
Maximum Reverse Leakage Current (IR) IR 1 uA At VR = 30 V 3
Peak Pulse Power Dissipation PPPM 1500 W Non-repetitive 10/1000us waveform (Notes 1, 2) 2
Steady State Power Dissipation PD 5 W Infinite heatsink at TA = 50°C (Note 3) 2
Peak Forward Surge Current IFSM 150 A 8.3 ms single half sine wave or equivalent square wave, duty cycle 4 per minute max (Note 4) 2
Operating Temperature Range TJ -55 150 °C 2
Storage Temperature Range TSTG -55 150 °C 2
Typical Thermal Resistance Junction to Lead RθJL 20 °C/W Junction to lead 2
Typical Thermal Resistance Junction to Ambient RθJA 100 °C/W Junction to ambient 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin • Lead Finish: Matte Tin • Case Material: Epoxy Molding Compound 1

CAD (KiCad official)

  • Symbol: 1.5SMBJ30CA
  • Footprint: Diode_SMD:D_SMB
  • 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
  • 3D model files: 1-5smbj30ca-etched.step / 1-5smbj30ca-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 1-5smbj30ca.step / 1-5smbj30ca.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: BORN datasheet (7 pp, sha256 62ec162cfcc3666d, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF