component

1.5SMBJ22A

Public Made by Adom

by adom

BORN TVS, DO-214AA(SMB). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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1.5SMBJ22A

BORN · TVS · DO-214AA(SMB)

1.5SMBJ22A from BORN, in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer BORN
Package DO-214AA(SMB)
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown Voltage (min) VBR 24.4 V @IT 1 mA (unidirectional 1.5SMBJ22A) 3
Breakdown Voltage (max) VBR 26.9 V @IT 1 mA (unidirectional 1.5SMBJ22A) 3
Maximum Clamping Voltage VC 35.5 V @ Ipp 42.3 A 3
Maximum Peak Pulse Current Ipp 42.3 A 3
Maximum Reverse Leakage Current IR 1 uA @VR (reverse stand-off 22 V) 3
Peak Pulse Power Dissipation PPPM 1500 W 10/1000us waveform, non-repetitive (Note 1,2) 2
Steady State Power Dissipation PD 5 W Infinite heatsink at TA=50°C (Note 3) 2
Peak Forward Surge Current IFSM 150 A 8.3ms single half sine wave or equivalent square wave (Note 4) 2
Maximum Instantaneous Forward Voltage VFM 5 V at 50A, unidirectional only (Note 5) 2
Operating Temperature Range TJ -55 150 °C 2
Storage Temperature Range TSTG -55 150 °C 2
Typical Thermal Resistance Junction to Lead RθJL 20 °C/W 2
Typical Thermal Resistance Junction to Ambient RθJA 100 °C/W Mounted on copper pad area of 5x5mm to each terminal (Note 2) 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin • Lead Finish: Matte Tin • Case Material: Epoxy Molding Compound 1

CAD (KiCad official)

  • Symbol: 1.5SMBJ22A
  • Footprint: Diode_SMD:D_SMB
  • 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
  • 3D model files: 1-5smbj22a-etched.step / 1-5smbj22a-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 1-5smbj22a.step / 1-5smbj22a.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: BORN datasheet (7 pp, sha256 62ec162cfcc3666d, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF