component
1.0SMBJ6.5CA
Public Made by Adomby adom
BORN TVS, DO-214AA(SMB). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdown1.0SMBJ6.5CA
BORN · TVS · DO-214AA(SMB)
1.0SMBJ6.5CA from BORN, in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | BORN |
| Package | DO-214AA(SMB) |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Stand-Off Voltage | VR | 6.5 | V | 3 | |||
| Breakdown Voltage | VBR | 7.22 | 7.98 | V | @ IT = 10 mA, TA=+25°C | 3 | |
| Maximum Clamping Voltage | VC | 11.2 | V | @ Ipp = 89.3 A | 3 | ||
| Maximum Peak Pulse Current | Ipp | 89.3 | A | 3 | |||
| Maximum Reverse Leakage | IR | 500 | uA | @ VR = 6.5 V | 3 | ||
| Peak Pulse Power Dissipation | PPPM | 1000 | W | TA=+25°C, 10/1000us waveform, non-repetitive | 2 | ||
| Steady State Power Dissipation | PD | 5 | W | Infinite heatsink at TA=50°C | 2 | ||
| Operating Temperature Range | TJ | -55 | 150 | °C | 2 | ||
| Storage Temperature Range | TSTG | -55 | 150 | °C | 2 | ||
| Thermal Resistance Junction to Lead | RθJL | 20 | °C/W | Typical | 2 | ||
| Thermal Resistance Junction to Ambient | RθJA | 100 | °C/W | Typical | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | • Lead Finish: Matte Tin • Case Material: Epoxy Molding Compound | 1 |
CAD (KiCad official)
- Symbol:
1.0SMBJ6.5CA - Footprint:
Diode_SMD:D_SMB - 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
- 3D model files:
1-0smbj6-5ca-etched.step/1-0smbj6-5ca-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);1-0smbj6-5ca.step/1-0smbj6-5ca.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: BORN datasheet (7 pp, sha256
cabf2740ff4065cc, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).