component
1.0SMBJ5.0CA
Public Made by Adomby adom
BORN TVS, DO-214AA(SMB). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
main
1.0SMBJ5.0CA
BORN · TVS · DO-214AA(SMB)
1.0SMBJ5.0CA from BORN, in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | BORN |
| Package | DO-214AA(SMB) |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Stand-Off Voltage | VR | 5 | V | 3 | |||
| Breakdown Voltage | VBR | 6.4 | 7 | V | @ IT = 10 mA | 3 | |
| Maximum Clamping Voltage | VC | 9.2 | V | @ Ipp = 108.7 A | 3 | ||
| Maximum Peak Pulse Current | Ipp | 108.7 | A | 3 | |||
| Maximum Reverse Leakage | IR | 800 | uA | @ VR = 5 V | 3 | ||
| Peak Pulse Power Dissipation | PPPM | 1000 | W | TA=+25°C, Non-repetitive current pulse, 10/1000us waveform, 5x5mm copper pad | 2 | ||
| Steady State Power Dissipation | PD | 5 | W | Infinite heatsink at TA=50°C | 2 | ||
| Peak Forward Surge Current | IFSM | 150 | A | 8.3ms single half sine wave, duty cycle=4 per minute max | 2 | ||
| Operating Temperature Range | TJ | -55 | 150 | °C | 2 | ||
| Storage Temperature Range | TSTG | -55 | 150 | °C | 2 | ||
| Thermal Resistance Junction to Lead | RθJL | 20 | °C/W | Typical | 2 | ||
| Thermal Resistance Junction to Ambient | RθJA | 100 | °C/W | Typical | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | • Lead Finish: Matte Tin • Case Material: Epoxy Molding Compound | 1 |
CAD (KiCad official)
- Symbol:
1.0SMBJ5.0CA - Footprint:
Diode_SMD:D_SMB - 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
- 3D model files:
1-0smbj5-0ca-etched.step/1-0smbj5-0ca-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);1-0smbj5-0ca.step/1-0smbj5-0ca.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: BORN datasheet (7 pp, sha256
cabf2740ff4065cc, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# 1.0SMBJ5.0CA
**BORN** · TVS · DO-214AA(SMB)
1.0SMBJ5.0CA from BORN, in a DO-214AA(SMB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | BORN |
| Package | DO-214AA(SMB) |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Stand-Off Voltage | VR | | 5 | | V | | 3 |
| Breakdown Voltage | VBR | 6.4 | | 7 | V | @ IT = 10 mA | 3 |
| Maximum Clamping Voltage | VC | | | 9.2 | V | @ Ipp = 108.7 A | 3 |
| Maximum Peak Pulse Current | Ipp | | | 108.7 | A | | 3 |
| Maximum Reverse Leakage | IR | | | 800 | uA | @ VR = 5 V | 3 |
| Peak Pulse Power Dissipation | PPPM | | | 1000 | W | TA=+25°C, Non-repetitive current pulse, 10/1000us waveform, 5x5mm copper pad | 2 |
| Steady State Power Dissipation | PD | | | 5 | W | Infinite heatsink at TA=50°C | 2 |
| Peak Forward Surge Current | IFSM | | | 150 | A | 8.3ms single half sine wave, duty cycle=4 per minute max | 2 |
| Operating Temperature Range | TJ | -55 | | 150 | °C | | 2 |
| Storage Temperature Range | TSTG | -55 | | 150 | °C | | 2 |
| Thermal Resistance Junction to Lead | RθJL | | 20 | | °C/W | Typical | 2 |
| Thermal Resistance Junction to Ambient | RθJA | | 100 | | °C/W | Typical | 2 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | | tin | • Lead Finish: Matte Tin • Case Material: Epoxy Molding Compound | 1 |
## CAD (KiCad official)
- Symbol: `1.0SMBJ5.0CA`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: DO-214AA(SMB) (KiCad packages3D, STEP)
- 3D model files: `1-0smbj5-0ca-etched.step` / `1-0smbj5-0ca-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `1-0smbj5-0ca.step` / `1-0smbj5-0ca.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [BORN datasheet](docs/1-0smbj5-0ca-datasheet.pdf) (7 pp, sha256 `cabf2740ff4065cc`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/1-0smbj5-0ca-datasheet.pdf)