component
06T2A32V
Public Made by Adomby adom
Hongda Fuses, 0603. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdown06T2A32V
Hongda · Fuses · 0603
06T2A32V from Hongda, in a 0603. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Hongda |
| Package | 0603 |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating temperature | -55 | 150 | ℃ | With proper correction factor applied | 6 | ||
| Preheat temperature min. (Tsmin) | Tsmin | 150 | ℃ | Lead(Pb) free solder, preheat and soak | 5 | ||
| Preheat temperature max. (Tsmax) | Tsmax | 200 | ℃ | Lead(Pb) free solder, preheat and soak | 5 | ||
| Time (Tsmin to Tsmax) | tS | 60 | 120 | Seconds | Preheat and soak, Lead(Pb) free solder | 5 | |
| Liquidus temperature | TL | 217 | ℃ | Max. liquidous temperature | 6 | ||
| Time at liquidous | tL | 60 | 150 | Seconds | 6 | ||
| Average ramp up rate Tsmax to Tp | 3 | ℃ / Second | Tsmax to Tp | 6 | |||
| Average ramp-down rate (TP to Tsmax) | 6 | ℃ / Second | TP to Tsmax | 6 | |||
| Time (25℃ to Peak Temperature) | 8 | Minutes | From 25℃ to peak temperature | 6 | |||
| Time in reservoir (wave solder) | 10 | seconds | Wave solder, reservoir temperature 260℃ | 4 | |||
| Reservoir temperature (wave solder) | 260 | ℃ | Wave solder | 4 | |||
| Infrared reflow temperature | 260 | ℃ | Infrared reflow | 4 | |||
| Time (infrared reflow) | 30 | seconds | Infrared reflow at 260℃ | 4 | |||
| Peak package body temperature (TP) | TP | 260 | ℃ | Lead(Pb) free solder classification temperature | 6 | ||
| Time within 5℃ of specified classification temperature (TC) | tP | 30 | Seconds | Within 5℃ of TC | 6 | ||
| Rated current | 2 | A | 2 | ||||
| Rated voltage DC | 32 | V | 2 | ||||
| Breaking capacity | 50 | A | Measured at rated voltage, time constant of less than 50 microseconds, battery source | 2 | |||
| Typical cold resistance | 78 | mOhms | Measured at <10% of rated current in ambient temperature of 25degrees | 2 | |||
| Typical voltage drop | 160 | mV | 2 | ||||
| Typical pre-arcing I2t | I2t | 0.115 | A2Sec | Measured at 10In current | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | blue | *Different with other ratings, the color of glass cover of 6A, 7A and 8A is BLUE color | 2 |
CAD (KiCad official)
- Symbol:
06T2A32V - Footprint:
Fuse:Fuse_0603_1608Metric - 3D model: 0603 (KiCad packages3D, STEP)
- 3D model files:
06t2a32v-etched.step/06t2a32v-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);06t2a32v.step/06t2a32v.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Hongda datasheet (6 pp, sha256
64e4ebe9388cb183, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).