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0121M4-20.000F08DTLJL

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HCI Crystals, SMD2016-4P. Pinout reviewed by a person against the datasheet, KiCad symbol/footprint/3D.

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0121M4-20.000F08DTLJL

HCI · Crystals · SMD2016-4P

0121M4-20.000F08DTLJL from HCI, in a SMD2016-4P. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CRYSTAL passive Crystal terminal; the datasheet pad table lists pad 1 as CRYSTAL, with load capacitance of 6 to 32pF or series and drive level of 10µW typ / 100µW max.
2 NC_or_GND passive N.C. or GND; pad 2 is connected to the metal lid and can be left open (floating) or connected to ground.
3 CRYSTAL passive Crystal terminal; the datasheet pad table lists pad 3 as CRYSTAL, with load capacitance of 6 to 32pF or series and drive level of 10µW typ / 100µW max.
4 NC_or_GND passive N.C. or GND; pad 4 is connected to the metal lid and can be left open (floating) or connected to ground.

Key specifications

Parameter Value
Manufacturer HCI
Package SMD2016-4P
Category Crystals, Oscillators, Resonators
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Equivalent series resistance (20.000 to 23.999MHz) ESR 125 Ω 20.000 to 23.999MHz 1
Shunt capacitance C0 3 pF 1
Drive level 10 100 µW 1
Operating temperature range (grade -20 to +70°C) -20 70 °C 1
Operating temperature range (grade -30 to +85°C) -30 85 °C 1
Storage temperature range -55 125 °C 1
Nominal frequency 20 MHz 1

CAD (KiCad official)

  • Symbol: 0121M4-20.000F08DTLJL
  • Footprint: Crystal:Crystal_SMD_2016-4Pin_2.0x1.6mm
  • 3D model: SMD2016-4P (KiCad packages3D, STEP)
  • 3D model files: 0121m4-20-000f08dtljl-etched.step / 0121m4-20-000f08dtljl-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 0121m4-20-000f08dtljl.step / 0121m4-20-000f08dtljl.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HCI datasheet (1 pp, sha256 c044c9714bc0d678, retrieved 2026-10-21, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF