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Reorder README: board section above simulation results/fixes

TylerK ·6e509bc4c3 ·1mo ago ·parent 2906034
1 file changed +21−20
README.md+21−20
@@ -9,6 +9,27 @@ input range.  --- +## The board++![Board, top-down](docs/board-top.png)++102 components across 9 functional blocks on a 195 x 135mm, 4-layer board: solar input+& protection (fuse, LM74700 ideal-diode stage), housekeeping bias (LM5165,+self-starting off raw panel input), the LM5175 MPPT/charge power stage,+current/voltage sensing (2x INA180), the MCU, two POL buck stages (TPS62130 5V/2A,+TLV62569 3.3V/1A), output filtering, and connectors plus test points. Full+block-by-block breakdown in [`docs/03-schematic-summary.md`](docs/03-schematic-summary.md).++![POL buck section close-up](docs/polbucks-closeup.png)++![Current-sense and MCU section close-up](docs/sensing-mcu-closeup.png)++Both close-ups show the fine-pitch layout this board's density demands: U8/U9 (the POL+bucks) are QFN-16 at 0.5mm pitch and SOT-563 at 0.5mm pitch, and U4 (the LM5175) is an+HTSSOP-28 at 0.65mm pitch — see "PCB status" below for how that played out in routing.+Full 4-layer copper plot: [`docs/routing.svg`](docs/routing.svg). Full schematic:+[`hardware/schematic.pdf`](hardware/schematic.pdf).+ ## Simulation-driven copper fixes  An electrothermal (DC current-density + steady-state thermal) simulation was run@@ -46,26 +67,6 @@ power stage cluster. Both results are **screening models** (board-surface temper not junction temperature; DC-only copper resistance excluding component/connector/ solder-joint resistance) — full caveats in the linked report. -## The board--![Board, top-down](docs/board-top.png)--102 components across 9 functional blocks on a 195 x 135mm, 4-layer board: solar input-& protection (fuse, LM74700 ideal-diode stage), housekeeping bias (LM5165,-self-starting off raw panel input), the LM5175 MPPT/charge power stage,-current/voltage sensing (2x INA180), the MCU, two POL buck stages (TPS62130 5V/2A,-TLV62569 3.3V/1A), output filtering, and connectors plus test points. Full-block-by-block breakdown in [`docs/03-schematic-summary.md`](docs/03-schematic-summary.md).--![POL buck section close-up](docs/polbucks-closeup.png)--![Current-sense and MCU section close-up](docs/sensing-mcu-closeup.png)--Both close-ups show the fine-pitch layout this board's density demands: U8/U9 (the POL-bucks) are QFN-16 at 0.5mm pitch and SOT-563 at 0.5mm pitch, and U4 (the LM5175) is an-HTSSOP-28 at 0.65mm pitch — see "PCB status" below for how that played out in routing.-Full 4-layer copper plot: [`docs/routing.svg`](docs/routing.svg).- ## Control architecture  The LM5175 exposes exactly one analog control input to firmware: its FB pin, which sets