Summary
every figure cited to the datasheet below- 0805 multilayer ceramic chip capacitor — 2.00 × 1.25 × 1.25 mm body (±0.10 mm), 0.50 mm termination bands; Ni inner electrodes, Cu termination, 100% Sn Pb-free platingp.1
- 470 nF ±10%, rated 50 V — X7R (Class II) dielectric, code Bp.1
- X7R temperature characteristic: capacitance change within ±15% from −55 to +125 °Cp.2
- Capacitance measured at 1 kHz ±10% / 1.0±0.2 Vrms, after a 150 °C 1-hour heat treatment and 24±2 h rest; dissipation factor 0.1 maxp.2
- Insulation resistance 10,000 MΩ or 100 MΩ·µF, whichever is smaller, at rated voltagep.2
- Withstands 250% of rated voltage with no dielectric or mechanical breakdown; high-temperature resistance test at 150% of rated voltage for 1,000 hp.2
- Recommended soldering: reflow, peak 260 +0/−5 °C, 10 s maxp.2
- Supplied on embossed (plastic) carrier tape, 7-inch reelp.1
CL21B474KBFNNNG is a 470 nF ±10% X7R ceramic in 0805 with a full 50 V ratingp.1 — the in-between value for filtering and timing where 100 nF is too small and 1 µF is more than the node needs. The X7R dielectric holds capacitance within ±15% across the whole −55 to +125 °C range, so it keeps its value at hot spots where an X5R part would already be out of spec.p.2
The reliability table carries the rest: dissipation factor 0.1 max at 1 kHz / 1.0 Vrms (measured after a 150 °C de-aging bake and 24-hour rest), insulation resistance of 10,000 MΩ or 100 MΩ·µF whichever is smaller, a 250%-of-rated withstanding-voltage proof, and a 1,000-hour life test at 150% of rated voltage.p.2 Reflow is the recommended soldering method — 260 +0/−5 °C peak, 10 s max.p.2 The document is Samsung's 3-page short-form spec: decode, dimensions, reliability table and soldering method only, with no tape dimensions, reel quantity, or bias/TCC curves.
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Datasheet
the source of every number on this page
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