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Contents

README

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ZSC31010CEG1-T

RENESAS · Interface - Specialized · SOIC-8

ZSC31010CEG1-T from RENESAS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Bsink output Optional bridge ground connection used for power savings. Connects to a switched transistor (RDS(ON) ~10Ω at VDD=5V, ~15Ω at VDD=3.0V) which interrupts bridge current between A/D conversions.
2 VBP input Positive bridge input to the differential chopper-stabilized instrumentation PREAMP. Leakage current ±10 nA max. Common-mode voltage range: 1V to VDD-1.3V.
3 N/C unconnected No connection. Pin is not internally bonded.
4 VBN input Negative bridge input to the differential chopper-stabilized instrumentation PREAMP. Leakage current ±10 nA max. Common-mode voltage range: 1V to VDD-1.3V.
5 Vgate output Gate control output for external JFET used for supply regulation or over-voltage protection when Vsupply exceeds 5.5V (up to 30V). Recommended JFETs: MMBF4392 (regulation) or Vishay J107 (over-voltage). Leave floating or unused when supply is 2.7-5.5V without JFET.
6 VDD power_in Analog supply voltage input, 2.7V to 5.5V (typ 5.0V). Requires 100-470nF (typ 220nF) external decoupling capacitor between VDD and ground. Current consumption 0.25 mA (min update rate) to 1.2 mA (max update rate).
7 SIG bidirectional ZACwire One-Wire Interface pin - serves as analog output (0-1V absolute or rail-to-rail ratiometric), digital output (ZACwire OWI serial), and calibration/configuration interface. On-chip 30 kΩ pull-up in digital mode and during command window. VZAC_low ≤ 0.2·VDD, VZAC_high ≥ 0.8·VDD. Max output current 2.2 mA, drives loads 2.5-20 kΩ and up to 15 nF.
8 VSS power_in Ground / negative supply reference.

Key specifications

Parameter Value
Manufacturer RENESAS
Package SOIC-8
Category Interface
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • ZSC31010CEG1-T
  • ZSC31010CEG1-R
  • ZSC31010CEG1-TCIG1-T
  • ZSC31010CEG1-TCIG1-R
  • ZSC31010CEG1-TCEB
  • ZSC31010CEG1-TCIB
  • ZSC31010CEG1-TCEC
  • ZSC31010CEG1-TCIC

CAD (KiCad official)

  • Symbol: ZSC31010CEG1-T
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: zsc31010ceg1-t-etched.step / zsc31010ceg1-t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); zsc31010ceg1-t.step / zsc31010ceg1-t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RENESAS datasheet (None pp, sha256 7ec059787f9e925b, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF