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XL1509-12E1

XLSEMI · DC-DC Converters · SOIC-8

XL1509-12E1 from XLSEMI, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Supply Voltage Input Pin. Operates from 4.5V to 40V DC. Bypass VIN to GND with a suitably large capacitor to eliminate input noise. Absolute maximum -0.3V to 45V.
2 OUTPUT power_out Power Switch Output Pin (SW). Switching node that supplies power to the external inductor/Schottky diode of the buck converter. Rated for 2A output current.
3 FEEDBACK input Feedback Pin (FB). Through an external resistor divider network, senses and regulates the output voltage. Internal reference threshold voltage is 1.23V. For the -12 fixed version, the internal divider is set so a direct connection to VOUT regulates at 12V.
4 ON/OFF input Enable Pin. Drive ON/OFF pin low to turn on the device; drive it high to turn it off. Floating defaults low (device on). TTL-compatible shutdown with hysteresis.
5 GND power_in Ground Pin. Care must be taken in layout: this pin should be placed outside of the Schottky diode-to-output-capacitor ground path to prevent switching current spikes from inducing voltage noise into the XL1509.
6 GND power_in Ground Pin. Care must be taken in layout: this pin should be placed outside of the Schottky diode-to-output-capacitor ground path to prevent switching current spikes from inducing voltage noise into the XL1509.
7 GND power_in Ground Pin. Care must be taken in layout: this pin should be placed outside of the Schottky diode-to-output-capacitor ground path to prevent switching current spikes from inducing voltage noise into the XL1509.
8 GND power_in Ground Pin. Care must be taken in layout: this pin should be placed outside of the Schottky diode-to-output-capacitor ground path to prevent switching current spikes from inducing voltage noise into the XL1509.

Key specifications

Parameter Value
Manufacturer XLSEMI
Package SOIC-8
Category PMIC
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • XL1509-12E1
  • XL1509-12E13.3E1
  • XL1509-12E15.0E1
  • XL1509-12E1ADJE1

CAD (KiCad official)

  • Symbol: XL1509-12E1
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
xl1509-12e1.step 122 KB You want the bare part, or you mark your own boards.
xl1509-12e1-etched.step 1.9 MB You want the part with XL1509-12E1 already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 487 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: XLSEMI datasheet (13 pp, sha256 8b10b01cdcb05276, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF