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Contents

README

markdown

W25X05CLSNIG

Winbond Elec · NOR FLASH · SOIC-8

W25X05CLSNIG from Winbond Elec, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 /CS input SPI Chip Select input, active low. When high, DO/IO0/IO1 pins are high impedance and the device is in standby. Must track VCC at power-up; a pull-up resistor may be used.
2 DO (IO1) bidirectional Serial Data Output for Standard SPI (unidirectional output on falling edge of CLK). Becomes bidirectional I/O pin IO1 during Dual SPI Fast Read Dual Output (3Bh) and Fast Read Dual I/O (BBh) instructions.
3 /WP input Write Protect input, active low. In conjunction with the Status Register SRP, TB, BP1 and BP0 bits, hardware-protects a portion or the entire memory array from write/erase and locks the Status Register.
4 GND power_in Ground reference (0V) for VCC (2.3V-3.6V supply).
5 DI (IO0) bidirectional Serial Data Input for Standard SPI (unidirectional input latched on rising edge of CLK for instructions/addresses/data). Becomes bidirectional I/O pin IO0 during Dual SPI Fast Read Dual Output (3Bh) and Fast Read Dual I/O (BBh) instructions.
6 CLK input SPI Serial Clock input, up to 104 MHz. Provides timing for serial input (rising edge) and output (falling edge) operations. Supports SPI Mode 0 (0,0) and Mode 3 (1,1).
7 /HOLD input Hold input, active low. When asserted with /CS low, pauses device operation: DO becomes high-impedance and DI/CLK are ignored, allowing the SPI bus to be shared without losing device state.
8 VCC power_in Power supply input, 2.3V to 3.6V (2.5V / 3V / 3.3V nominal). Typical 1 mA active current, <1 uA power-down.

Key specifications

Parameter Value
Manufacturer Winbond Elec
Package SOIC-8
Category Memory
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • W25X05CLSNIG
  • W25X05CLSNIGSV
  • W25X05CLSNIGSD
  • W25X05CLSNIGUX

CAD (KiCad official)

  • Symbol: W25X05CLSNIG
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
w25x05clsnig.step 122 KB You want the bare part, or you mark your own boards.
w25x05clsnig-etched.step 2.4 MB You want the part with W25X05CLSNIG already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 591 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Winbond Elec datasheet (49 pp, sha256 155c39e3a18d20f2, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF