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W25Q80DVSNIG TR

Winbond · NOR FLASH · SOIC-8

W25Q80DVSNIG TR from Winbond, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 /CS input Active-low SPI Chip Select input. Drive low to enable device access; when high the device is deselected and DO/IO pins are high-Z. /CS must track VCC at power-up (per power-up timing).
2 DO/IO1 bidirectional Standard SPI serial data output (DO); in Dual/Quad SPI modes acts as bidirectional IO1. In Standard/Dual SPI this pin is DO; when QE=1 in Status Register-2 it becomes IO1 for Quad SPI.
3 /WP/IO2 bidirectional Active-low hardware Write Protect input in Standard/Dual SPI, used with the Status Register Block Protect (CMP/SEC/TB/BP2/BP1/BP0) and SRP0 bits. Becomes bidirectional IO2 for Quad SPI when the Quad Enable (QE) bit is set.
4 GND power_in Device ground reference for all logic and I/O signaling.
5 DI/IO0 bidirectional Standard SPI serial data input (DI); latched on rising edge of CLK. In Dual/Quad SPI acts as bidirectional IO0 for command, address, and data phases.
6 CLK input SPI Serial Clock input, up to 104 MHz. Provides timing for serial input/output; data on DI/IOx is latched on rising edge, data on DO/IOx is shifted out on falling edge.
7 /HOLD/IO3 bidirectional Active-low Hold input in Standard/Dual SPI: while /CS is low, driving /HOLD low pauses the device with DO high-Z and DI/CLK ignored. Becomes bidirectional IO3 for Quad SPI when the Quad Enable (QE) bit in Status Register-2 is set.
8 VCC power_in Main power supply, 2.7V to 3.6V single-supply. Decouple with a local bypass capacitor to GND.

Key specifications

Parameter Value
Manufacturer Winbond
Package SOIC-8
Category Memory
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • W25Q80DVSNIG TR
  • W25Q80DVSNIG TRSS
  • W25Q80DVSNIG TRSV
  • W25Q80DVSNIG TRZP
  • W25Q80DVSNIG TRUX
  • W25Q80DVSNIG TRUXIE
  • W25Q80DVSNIG TRDA
  • W25Q80DVSNIG TRBY

CAD (KiCad official)

  • Symbol: W25Q80DVSNIG TR
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Winbond datasheet (71 pp, sha256 3300ea3e9d2cda4e, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF