W25Q256JVFIQ
Public Unreviewedby Ray
Winbond Elec NOR FLASH, SOIC-16-300mil. Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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README
markdownW25Q256JVFIQ
Winbond Elec · NOR FLASH · SOIC-16-300mil
W25Q256JVFIQ from Winbond Elec, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | /HOLD or /RESET (IO3) | bidirectional | Multi-function pin. In Standard/Dual SPI acts as active-low /HOLD (pauses device while /CS is low; DO goes hi-Z and DI/CLK ignored). In Quad SPI (QE=1) becomes bidirectional data line IO3. On -IQ ordering variants (this MPN) /HOLD is disabled and QE=1 is fixed. |
| 2 | VCC | power_in | Power supply pin. Operating range 2.7 V to 3.6 V. /CS input must track VCC at power-up and power-down. |
| 3 | /RESET | input | Dedicated active-low hardware reset input. Driving it low for a minimum of ~1 µs terminates any external or internal operation and returns the device to its power-on state. If unused, can be left floating or tied to VCC. |
| 4 | NC | unconnected | No connect. Leave floating. |
| 5 | NC | unconnected | No connect. Leave floating. |
| 6 | NC | unconnected | No connect. Leave floating. |
| 7 | /CS | input | Active-low SPI chip select input. When high, device is deselected and DO/IOx are high impedance (standby). Driving low selects the device for instructions. Must transition high-to-low before each new instruction and track VCC at power-up/down; an external pull-up is recommended. |
| 8 | DO (IO1) | bidirectional | Serial Data Output in Standard SPI (unidirectional, updated on falling edge of CLK). In Dual/Quad SPI becomes bidirectional data line IO1. |
| 9 | /WP (IO2) | bidirectional | Active-low Write Protect input in Standard/Dual SPI; when used with the CMP, SEC, TB, BP0-BP2 and SRP bits, prevents Status Register or memory-array writes. In Quad SPI (QE=1) becomes bidirectional data line IO2. |
| 10 | GND | power_in | Device ground return. |
| 11 | NC | unconnected | No connect. Leave floating. |
| 12 | NC | unconnected | No connect. Leave floating. |
| 13 | NC | unconnected | No connect. Leave floating. |
| 14 | NC | unconnected | No connect. Leave floating. |
| 15 | DI (IO0) | bidirectional | Serial Data Input in Standard SPI (unidirectional, sampled on rising edge of CLK for instructions, addresses, and program data). In Dual/Quad SPI becomes bidirectional data line IO0. |
| 16 | CLK | input | SPI Serial Clock input providing timing for serial input and output operations. Supports up to 133 MHz. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Winbond Elec |
| Package | SOIC-16-300mil |
| Category | Memory |
| Pins | 16 |
Ordering variants
Same part, different packaging or reel option.
W25Q256JVFIQW25Q256JVFIQFIMW25Q256JVFIQEIQW25Q256JVFIQEIMW25Q256JVFIQBIQW25Q256JVFIQBIMW25Q256JVFIQCIQW25Q256JVFIQCIM
CAD (KiCad official)
- Symbol:
W25Q256JVFIQ - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
3D model downloads
Two STEP files. Same geometry, different body top:
| File | Size | Use it when |
|---|---|---|
w25q256jvfiq.step |
217 KB | You want the bare part, or you mark your own boards. |
w25q256jvfiq-etched.step |
2.8 MB | You want the part with W25Q256JVFIQ already on it. |
The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 692 faces against 267 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Winbond Elec datasheet (92 pp, sha256
0f18a76476aee735, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).