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Contents

README

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TPS56628DDAR

Texas Instruments · DC-DC Converters · SOIC-8-EP

TPS56628DDAR from Texas Instruments, in a SOIC-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 EN input Enable input control. Active high; must be pulled high to enable the converter. Internal ~400 kΩ pull-down to GND (200-800 kΩ). Absolute max −0.3 V to 20 V.
2 VFB input Converter feedback input. Connect to output voltage through a feedback resistor divider. Regulation threshold ≈ 0.765 V (typical). Absolute max −0.3 V to 6.5 V.
3 VREG5 power_out 5.5 V internal LDO regulator output used for internal bias. Requires a decoupling capacitor (typical 1 µF) to GND. Not active when EN is low. Output up to ~20 mA.
4 PG output Open-drain Power Good output. Asserts high (via external pull-up) when VFB rises above ~90% of nominal; deasserts below ~85%. Absolute max −0.3 V to 6.5 V; sink capability 2-4 mA.
5 GND power_in Ground pin. Power ground return for the switching circuit. Connect sensitive VFB return to GND at a single point.
6 SW output Switch node between the internal high-side and low-side NFETs. Connect to the output inductor. Absolute max −2 V to 20 V (−3 V to 22 V for 10 ns transient).
7 VBST power_in Bootstrap supply for the high-side FET gate driver. Connect a 0.1 µF capacitor from VBST to SW. An internal diode is connected between VREG5 and VBST. Absolute max −0.3 V to 26 V (−0.3 V to 6.5 V vs SW).
8 VIN power_in Input voltage supply pin. Operating range 4.5 V to 18 V; absolute max 20 V. Bypass locally with ceramic capacitance to GND.
9 PAD power_in Exposed thermal pad on the back side of the package. Must be soldered to the PCB ground plane to achieve adequate thermal dissipation. Must be connected to GND.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-8-EP
Category PMIC
Pins 9

Ordering variants

Same part, different packaging or reel option.

  • TPS56628DDAR

CAD (KiCad official)

  • Symbol: TPS56628DDAR
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • 3D model: SOIC-8-EP (KiCad packages3D, STEP)
  • 3D model files: tps56628ddar-etched.step / tps56628ddar-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps56628ddar.step / tps56628ddar.glb are the bare package body.

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
tps56628ddar.step 125 KB You want the bare part, or you mark your own boards.
tps56628ddar-etched.step 2.8 MB You want the part with TPS56628DDAR already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 659 faces against 152 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (25 pp, sha256 856a489d599d233c, retrieved 2026-08-17, tier: manufacturer)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF