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TLV61220DBVR

Public Made by Adom

by adom

Texas Instruments DC-DC Converters, SOT-23-6. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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TLV61220DBVR

Texas Instruments · DC-DC Converters · SOT-23-6

TLV61220DBVR from Texas Instruments, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SW input Boost and rectifying switch input. Connects to the external inductor between VBAT and the internal synchronous switches. Absolute max voltage 7.5 V.
2 GND power_in IC ground connection for logic and power. Reference for all internal circuitry and the return path for the switching current.
3 EN input Enable input; drive to VBAT to enable the converter, drive to GND to disable and enter shutdown. VIH = 0.8 x VIN (VIN <= 1.5 V) or 1.2 V (VIN > 1.5 V); VIL = 0.2 x VIN or 0.4 V respectively. Input current 0.1 µA max.
4 FB input Voltage feedback for programming the output voltage via an external resistor divider from VOUT. Internal reference VFB = 500 mV (typ). Feedback input current 0.01 µA (typ).
5 VOUT power_out Boost converter output. Connect the output capacitor (typ 10 µF) and the feedback divider here. Output voltage range 1.8 V to 5.5 V; overvoltage protection threshold 5.5-7.5 V.
6 VBAT power_in Supply voltage input from the battery/source. Operating range 0.7 V to 5.5 V; startup min 0.7 V into >=150 Ω load. Connect input capacitor (typ 10 µF) close to this pin.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOT-23-6
Category PMIC
Pins 6

Ordering variants

Same part, different packaging or reel option.

  • TLV61220DBVR
  • TLV61220DBVRDBVT

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input voltage on VBAT, SW, VOUT, EN, FB VIN -0.3 7.5 V 4
Operating junction temperature TJ -40 150 °C 4
Storage temperature Tstg -65 150 °C 4
Supply voltage at VIN VIN 0.7 5.5 V 4
Operating free air temperature range TA -40 85 °C 4
Operating virtual junction temperature range TJ -40 125 °C 4
Input voltage range VIN 0.7 5.5 V 5
TLV61220 output voltage range VOUT 1.8 5.5 V VIN < VOUT 5
TLV61220 feedback voltage VFB 483 500 513 mV 5
Switch current limit ISW 220 400 mA VOUT = 3.3 V, VIN = 1.2 V, TA = 25 °C 5
Switch current limit ISW 180 400 mA VOUT = 3.3 V, TA = -40°C to 85 °C 5
Switch current limit ISW 200 400 mA VOUT = 3.3 V, TA = 0°C to 85 °C 5
Quiescent current (VIN) IQ 0.5 0.9 μA IO = 0 mA, VEN = VIN = 1.2 V, VOUT = 3.3 V 5
Quiescent current (VOUT) IQ 5 7.5 μA IO = 0 mA, VEN = VIN = 1.2 V, VOUT = 3.3 V 5
Shutdown current (VIN) ISD 0.2 0.5 μA VEN = 0 V, VIN = 1.2 V, VOUT ≥ VIN 5
Leakage current into SW ILKG 0.01 0.2 μA VEN = 0 V, VIN = 1.2 V, VSW = 1.2 V, VOUT ≥ VIN 5
EN input current IEN 0.005 0.1 μA Clamped on GND or VIN (VIN < 1.5 V) 5
EN input low voltage VIL 0.4 V 5 V > VIN > 1.5 V 5
EN input high voltage VIH 1.2 V 5 V > VIN > 1.5 V 5
Undervoltage lockout threshold for turn off VUVLO 0.5 0.7 V VIN decreasing 5
Overvoltage protection threshold 5.5 7.5 V 5
Minimum input voltage at startup VIN 0.7 V RLoad ≥ 150 Ω 5
Inductor current ripple ILH 200 mA 5
Rectifying switch on resistance (VOUT = 3.3 V) RDS(on) 1000 mΩ VOUT = 3.3 V 5
Rectifying switch on resistance (VOUT = 5 V) RDS(on) 700 mΩ VOUT = 5 V 5
Main switch on resistance (VOUT = 3.3 V) RDS(on) 600 mΩ VOUT = 3.3 V 5
Main switch on resistance (VOUT = 5 V) RDS(on) 550 mΩ VOUT = 5 V 5
Line regulation 0.5 % VIN < VOUT 5
Load regulation 0.5 % VIN < VOUT 5
Shutdown current into VOUT / leakage current into VOUT 1 μA VEN = 0 V, VIN = 1.2 V, VOUT = 3.3 V 5
TLV61220 feedback input current IFB 0.01 μA VFB = 0.5 V 5
Overtemperature protection 140 °C 5
Overtemperature hysteresis 20 °C 5
Junction-to-ambient thermal resistance RθJA 185.7 °C/W DBV 6-pin package 4
Junction-to-case (top) thermal resistance RθJC(top) 124.3 °C/W DBV 6-pin package 4
Junction-to-board thermal resistance RθJB 31.3 °C/W DBV 6-pin package 4
Junction-to-top characterization parameter ψJT 22.9 °C/W DBV 6-pin package 4
Junction-to-board characterization parameter ψJB 30.8 °C/W DBV 6-pin package 4

CAD (KiCad official)

  • Symbol: TLV61220DBVR
  • Footprint: Package_TO_SOT_SMD:SOT-23-6
  • 3D model: SOT-23-6 (KiCad packages3D, STEP)
  • 3D model files: tlv61220dbvr-etched.step / tlv61220dbvr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tlv61220dbvr.step / tlv61220dbvr.glb are the bare package body.

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
tlv61220dbvr.step 97 KB You want the bare part, or you mark your own boards.
tlv61220dbvr-etched.step 2.1 MB You want the part with TLV61220DBVR already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 514 faces against 117 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (25 pp, sha256 99e54c57c50d4867, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF