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TLV2314QDRQ1

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Texas Instruments Operational Amplifier, SOIC-8. Datasheet-verified pinout, KiCad symbol/footprint/3D.

componentop-amp-cmptlv2314qdrq1
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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

markdown

TLV2314QDRQ1

Texas Instruments · Operational Amplifier · SOIC-8

TLV2314QDRQ1 from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT A output Channel A op-amp output. Rail-to-rail output stage; open-loop output impedance ~570Ω, short-circuit current ~±20mA.
2 -IN A input Channel A inverting input. High-impedance input; typical input bias current 1pA. Input voltage must remain within (V-) - 0.5V to (V+) + 0.5V.
3 +IN A input Channel A non-inverting input. Rail-to-rail common-mode input range (V-)-0.2V to (V+)+0.2V; 1pA typical bias current.
4 V- power_in Negative (lowest) supply rail. Ground for single-supply operation, or negative rail for split supplies. Total V+ to V- supply range 1.8V to 5.5V.
5 +IN B input Channel B non-inverting input. Rail-to-rail common-mode input range (V-)-0.2V to (V+)+0.2V; 1pA typical bias current.
6 -IN B input Channel B inverting input. High-impedance input; typical input bias current 1pA. Input voltage must remain within (V-) - 0.5V to (V+) + 0.5V.
7 OUT B output Channel B op-amp output. Rail-to-rail output stage; open-loop output impedance ~570Ω, short-circuit current ~±20mA.
8 V+ power_in Positive (highest) supply rail. Absolute maximum 7V; recommended operating range 1.8V to 5.5V referenced to V-. Bypass to V- with a local decoupling capacitor.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-8
Category Op-amp/Cmp
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • TLV2314QDRQ1
  • TLV2314QDRQ1D
  • TLV2314QDRQ1DGK
  • TLV2314QDRQ1DBV
  • TLV2314QDRQ1DCK
  • TLV2314QDRQ1PW

CAD (KiCad official)

  • Symbol: TLV2314QDRQ1
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: tlv2314qdrq1-etched.step / tlv2314qdrq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tlv2314qdrq1.step / tlv2314qdrq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (32 pp, sha256 e88e2a80ed88199c, retrieved 2026-08-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF