THVD2410DR from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	R	output	Receive data output. Digital CMOS output presenting the recovered logic level from the differential A/B bus (VOH ≥ VCC−0.4 V at −8 mA, VOL ≤ 0.4 V at 8 mA). High-impedance when the receiver is disabled (RE = VCC).
2	RE	input	Receiver enable, active low. Digital input with 2-MΩ internal pull-up; drive low to enable the receiver output on pin R, drive high to place R in Hi-Z. Combined RE=high and DE=low condition triggers low-power shutdown.
3	DE	input	Driver enable, active high. Digital input with 2-MΩ internal pull-down; drive high to enable the A/B differential line driver, drive low to place the driver outputs in Hi-Z. Combined RE=high and DE=low condition triggers low-power shutdown.
4	D	input	Driver data input. Digital CMOS input (VIH ≥ 2 V, VIL ≤ 0.8 V) whose logic state sets the polarity of the differential signal driven onto the A and B bus pins when DE is high.
5	GND	power_in	Device ground reference (0 V).
6	A	bidirectional	RS-485/RS-422 bus I/O port A (non-inverting, complementary to B). Fault-protected to ±70 V DC, tolerates ±25 V common-mode, and withstands ±16-kV HBM / ±12-kV IEC 61000-4-2 ESD. Differential driver output when DE=high; receiver input when RE=low.
7	B	bidirectional	RS-485/RS-422 bus I/O port B (inverting, complementary to A). Fault-protected to ±70 V DC, tolerates ±25 V common-mode, and withstands ±16-kV HBM / ±12-kV IEC 61000-4-2 ESD. Differential driver output when DE=high; receiver input when RE=low.
8	VCC	power_in	Supply voltage input, 3 V to 5.5 V (3.3-V or 5-V nominal). Quiescent current ~5.6 mA with driver and receiver enabled; <1 µA in shutdown. Recommended to bypass with a 100-nF ceramic capacitor to GND close to the pin.

Key specifications

Parameter	Value
Manufacturer	Texas Instruments
Package	SOIC-8
Category	Comm/UART
Pins	8

Ordering variants

Same part, different packaging or reel option.

THVD2410DR
THVD2410DRD
THVD2410DRDGK
THVD2410DRDGKR
THVD2410DRB
THVD2410DRBR

CAD (KiCad official)

Symbol: THVD2410DR
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8 (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File	Size	Use it when
`thvd2410dr.step`	122 KB	You want the bare part, or you mark your own boards.
`thvd2410dr-etched.step`	1.8 MB	You want the part with `THVD2410DR` already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 465 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Texas Instruments datasheet (37 pp, sha256 56ecf696d8061566, retrieved 2026-08-17, tier: manufacturer)
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF