component
STM32F100C6T6BTR
Public Unreviewedby Ray
STMicroelectronics Microcontrollers (MCU/MPU/SOC), LQFP-48(7x7). Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownSTM32F100C6T6BTR
STMicroelectronics · Microcontrollers (MCU/MPU/SOC) · LQFP-48(7x7)
STM32F100C6T6BTR from STMicroelectronics, in a LQFP-48(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VBAT | power_in | Backup battery supply for RTC, LSE oscillator and backup registers when VDD is off. Typical 1.8-3.6 V. |
| 2 | PC13-TAMPER-RTC | bidirectional | GPIO PC13 in backup domain; alternate: TAMPER input and RTC alarm output. Supplied through the backup power switch; limited drive (max 2 MHz, 30 pF, no LED load). |
| 3 | PC14-OSC32_IN | bidirectional | LSE (32.768 kHz) crystal input; alternate GPIO PC14. Backup-domain pin with restricted GPIO drive. |
| 4 | PC15-OSC32_OUT | bidirectional | LSE (32.768 kHz) crystal output; alternate GPIO PC15. Backup-domain pin with restricted GPIO drive. |
| 5 | PD0-OSC_IN | bidirectional | HSE (4-24 MHz) crystal input after reset; remappable to GPIO PD0 via software. |
| 6 | PD1-OSC_OUT | bidirectional | HSE (4-24 MHz) crystal output after reset; remappable to GPIO PD1 via software. |
| 7 | NRST | bidirectional | Active-low device reset. Bidirectional (internal pull-up ~40 kΩ); asserting low forces MCU into reset. |
| 8 | VSSA | power_in | Analog ground for ADC, DAC and reset/PVD block. |
| 9 | VDDA | power_in | Analog supply for ADC, DAC, reset block, PLL and RC oscillators. 2.0-3.6 V, tied to VDD. |
| 10 | PA0-WKUP | bidirectional | GPIO PA0; alternate: WKUP (wake-from-Standby), USART2_CTS, ADC1_IN0, TIM2_CH1_ETR. |
| 11 | PA1 | bidirectional | GPIO PA1; alternate: USART2_RTS, ADC1_IN1, TIM2_CH2. |
| 12 | PA2 | bidirectional | GPIO PA2; alternate: USART2_TX, ADC1_IN2, TIM2_CH3, TIM15_CH1. |
| 13 | PA3 | bidirectional | GPIO PA3; alternate: USART2_RX, ADC1_IN3, TIM2_CH4, TIM15_CH2. |
| 14 | PA4 | bidirectional | GPIO PA4; alternate: SPI1_NSS, USART2_CK, ADC1_IN4, DAC1_OUT. |
| 15 | PA5 | bidirectional | GPIO PA5; alternate: SPI1_SCK, ADC1_IN5, DAC2_OUT. |
| 16 | PA6 | bidirectional | GPIO PA6; alternate: SPI1_MISO, ADC1_IN6, TIM3_CH1, TIM1_BKIN, TIM16_CH1. |
| 17 | PA7 | bidirectional | GPIO PA7; alternate: SPI1_MOSI, ADC1_IN7, TIM3_CH2, TIM1_CH1N, TIM17_CH1. |
| 18 | PB0 | bidirectional | GPIO PB0; alternate: ADC1_IN8, TIM3_CH3, TIM1_CH2N. |
| 19 | PB1 | bidirectional | GPIO PB1; alternate: ADC1_IN9, TIM3_CH4, TIM1_CH3N. |
| 20 | PB2/BOOT1 | bidirectional | GPIO PB2 (5 V-tolerant); doubles as BOOT1 sampling input at reset to select boot memory. |
| 21 | PB10 | bidirectional | GPIO PB10 (5 V-tolerant); alternate: USART3_TX, TIM2_CH3, HDMI_CEC. I2C2_SCL not available on low-density value line. |
| 22 | PB11 | bidirectional | GPIO PB11 (5 V-tolerant); alternate: USART3_RX, TIM2_CH4. I2C2_SDA not available on low-density value line. |
| 23 | VSS_1 | power_in | Digital ground (pair with VDD_1). |
| 24 | VDD_1 | power_in | Digital supply, 2.0-3.6 V (pair with VSS_1). Requires 100 nF decoupling. |
| 25 | PB12 | bidirectional | GPIO PB12 (5 V-tolerant); alternate: TIM1_BKIN, USART3_CK. SPI2/I2C2 alternates not available on low-density value line. |
| 26 | PB13 | bidirectional | GPIO PB13 (5 V-tolerant); alternate: TIM1_CH1N, USART3_CTS. SPI2_SCK not available on low-density value line. |
| 27 | PB14 | bidirectional | GPIO PB14 (5 V-tolerant); alternate: TIM1_CH2N, USART3_RTS, TIM15_CH1. SPI2_MISO not available on low-density value line. |
| 28 | PB15 | bidirectional | GPIO PB15 (5 V-tolerant); alternate: TIM1_CH3N, TIM15_CH1N, TIM15_CH2. SPI2_MOSI not available on low-density value line. |
| 29 | PA8 | bidirectional | GPIO PA8 (5 V-tolerant); alternate: USART1_CK, MCO (master clock output), TIM1_CH1. |
| 30 | PA9 | bidirectional | GPIO PA9 (5 V-tolerant); alternate: USART1_TX, TIM1_CH2, TIM15_BKIN. |
| 31 | PA10 | bidirectional | GPIO PA10 (5 V-tolerant); alternate: USART1_RX, TIM1_CH3, TIM17_BKIN. |
| 32 | PA11 | bidirectional | GPIO PA11 (5 V-tolerant); alternate: USART1_CTS, TIM1_CH4. |
| 33 | PA12 | bidirectional | GPIO PA12 (5 V-tolerant); alternate: USART1_RTS, TIM1_ETR. |
| 34 | PA13/JTMS-SWDIO | bidirectional | SWD data / JTAG TMS after reset (5 V-tolerant); remappable to GPIO PA13. |
| 35 | VSS_2 | power_in | Digital ground (pair with VDD_2). |
| 36 | VDD_2 | power_in | Digital supply, 2.0-3.6 V (pair with VSS_2). Requires 100 nF decoupling. |
| 37 | PA14/JTCK-SWCLK | bidirectional | SWD clock / JTAG TCK after reset (5 V-tolerant); remappable to GPIO PA14. |
| 38 | PA15/JTDI | bidirectional | JTAG data-in after reset (5 V-tolerant); remap options: GPIO PA15, TIM2_CH1_ETR, SPI1_NSS. |
| 39 | PB3/JTDO | bidirectional | JTAG data-out / TRACESWO after reset (5 V-tolerant); remap options: GPIO PB3, TIM2_CH2, SPI1_SCK. |
| 40 | PB4/NJTRST | bidirectional | JTAG reset (active-low) after reset (5 V-tolerant); remap options: GPIO PB4, TIM3_CH1, SPI1_MISO. |
| 41 | PB5 | bidirectional | GPIO PB5 (not 5 V-tolerant); alternate: I2C1_SMBA, TIM16_BKIN, TIM3_CH2, SPI1_MOSI. |
| 42 | PB6 | bidirectional | GPIO PB6 (5 V-tolerant); alternate: I2C1_SCL, TIM16_CH1N, USART1_TX. TIM4 alternates not available on low-density value line. |
| 43 | PB7 | bidirectional | GPIO PB7 (5 V-tolerant); alternate: I2C1_SDA, TIM17_CH1N, USART1_RX. TIM4 alternates not available on low-density value line. |
| 44 | BOOT0 | input | Boot-mode select input sampled at reset (with PB2/BOOT1) to choose main Flash, system memory, or embedded SRAM boot. |
| 45 | PB8 | bidirectional | GPIO PB8 (5 V-tolerant); alternate: TIM16_CH1, CEC, I2C1_SCL (remap). TIM4_CH3 not available on low-density value line. |
| 46 | PB9 | bidirectional | GPIO PB9 (5 V-tolerant); alternate: TIM17_CH1, I2C1_SDA (remap). TIM4_CH4 not available on low-density value line. |
| 47 | VSS_3 | power_in | Digital ground (pair with VDD_3). |
| 48 | VDD_3 | power_in | Digital supply, 2.0-3.6 V (pair with VSS_3). Requires 100 nF decoupling. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | LQFP-48(7x7) |
| Category | MCU |
| Pins | 48 |
Ordering variants
Same part, different packaging or reel option.
STM32F100C6T6BTRSTM32F100C6T6BTRC6T7BSTM32F100C6T6BTRC6T7BTRSTM32F100C6T6BTRR6T6BSTM32F100C6T6BTRR6T6BTRSTM32F100C6T6BTRR6T7BSTM32F100C6T6BTRR6T7BTRSTM32F100C6T6BTRV8T6BSTM32F100C6T6BTRV8T7BSTM32F100C6T6BTRVBT6BSTM32F100C6T6BTRVBT7BSTM32F100C6T6BTRRxHxB
CAD (KiCad official)
- Symbol:
STM32F100C6T6BTR - Footprint:
Package_QFP:LQFP-48_7x7mm_P0.5mm - 3D model: LQFP-48(7x7) (KiCad packages3D, STEP)
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: STMicroelectronics datasheet (96 pp, sha256
360e3be010cabad4, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).