SSP485 from Shanghai Siproin Microelectronics, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	RO	output	Receiver output. RO is high when A-B >= -0.05V, low when A-B <= -0.2V, and high (fail-safe) when A and B are open or shorted. High-impedance when /RE is high.
2	/RE	input	Active-low receiver output enable. RO is enabled when /RE is low; RO is high-impedance when /RE is high. Driving /RE high with DE low puts the device into low-current shutdown.
3	DE	input	Driver output enable (active high). Driving DE high enables the A/B differential driver outputs; DE low puts A and B into high-impedance.
4	DI	input	Driver input. A low on DI forces A low and B high; a high on DI forces A high and B low (when DE is high).
5	GND	power_in	Ground reference (0V).
6	A	bidirectional	Non-inverting differential bus I/O. Receiver non-inverting input and driver non-inverting output for the RS-485/RS-422 twisted-pair bus. +/-15kV HBM ESD protected; withstands -13V to +13V bus common-mode.
7	B	bidirectional	Inverting differential bus I/O. Receiver inverting input and driver inverting output for the RS-485/RS-422 twisted-pair bus. +/-15kV HBM ESD protected; withstands -13V to +13V bus common-mode.
8	VDD	power_in	Positive supply voltage, typically +5V (absolute max -0.3V to +7V). Bypass to GND with a local 0.1uF ceramic capacitor.

Key specifications

Parameter	Value
Manufacturer	Shanghai Siproin Microelectronics
Package	SOP-8
Category	Interface
Pins	8

Ordering variants

Same part, different packaging or reel option.

SSP485

CAD (KiCad official)

Symbol: SSP485
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOP-8 (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File	Size	Use it when
`ssp485.step`	122 KB	You want the bare part, or you mark your own boards.
`ssp485-etched.step`	1.8 MB	You want the part with `SSP485` already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 433 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Shanghai Siproin Microelectronics datasheet (11 pp, sha256 f2d022a6889a4bdc, retrieved 2026-08-17, tier: lcsc)
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF