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Contents

README

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NDP1360KC

NDP · DC-DC Converters · SOP-8

NDP1360KC from NDP, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 FB input Feedback of output voltage. Connect a resistor divider from VOUT to this pin; the internal reference is 1.0V (VREF = 0.985 to 1.015V) and FB bias current is ≤0.2µA.
2 CSP input Positive pole of the current-sense amplifier. Connects to the high side of the external current-sense element; sensed with respect to CSN1/CSN2 with a typical 55mV threshold (51-59mV) for cycle-by-cycle current limiting. Absolute max -0.3 to 25V vs GND.
3 CSN1 input Negative pole 1 of current sense. Forms channel-1 differential input with CSP (VCS1 = 51/55/59mV min/typ/max) for dual-channel CC/CV mode control. Absolute max -0.3 to 25V vs GND.
4 CSN2 input Negative pole 2 of current sense. Forms channel-2 differential input with CSP (VCS2 = 51/55/59mV min/typ/max) for dual-channel CC/CV mode control. Absolute max -0.3 to 25V vs GND.
5 GND power_in Device ground return. Connect to the system ground plane with a low-impedance path close to the input capacitor.
6 VIN power_in Power input to the converter and internal high-side MOSFET drain. Operating range 7.5V to 30V (absolute max 33V). Bypass with a ≥2.2µF ceramic capacitor placed close to the pin.
7 BST passive Bootstrap capacitor pin for the high-side MOSFET gate driver. Connect a 100nF ceramic capacitor from BST to SW. Absolute max -0.3V to VIN+7V vs GND.
8 SW power_out Switching node - common source/drain of the internal high-side and low-side MOSFETs (RDSON ≈ 12mΩ each). Connect to the external inductor (typ. 22µH). Absolute max -0.3V to VIN+0.3V vs GND.

Key specifications

Parameter Value
Manufacturer NDP
Package SOP-8
Category PMIC
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • NDP1360KC

CAD (KiCad official)

  • Symbol: NDP1360KC
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: ndp1360kc-etched.step / ndp1360kc-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ndp1360kc.step / ndp1360kc.glb are the bare package body.

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
ndp1360kc.step 122 KB You want the bare part, or you mark your own boards.
ndp1360kc-etched.step 2.0 MB You want the part with NDP1360KC already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 483 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: NDP datasheet (14 pp, sha256 68b5401ff6b119ab, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF