NCP176AMX330TCG
Public Made by Adomby adom
onsemi Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, XDFN-6-EP(1.2x1.2). Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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README
markdownNCP176AMX330TCG
onsemi · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · XDFN-6-EP(1.2x1.2)
NCP176AMX330TCG from onsemi, in a XDFN-6-EP(1.2x1.2). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | power_out | LDO regulated output pin. Fixed 3.3 V nominal for this variant; sources up to 500 mA. Requires a 1 uF ceramic output capacitor for stability. |
| 2 | FB | input | Feedback input pin sensing the regulated output for the internal error amplifier. Connect directly to OUT (or the load Kelvin point) in the fixed-output configuration. |
| 3 | GND | power_in | Device ground reference pin. Common return for the input, output and control circuitry. |
| 4 | EN | input | Chip enable input, active High. V_ENH >= 1.0 V enables the regulator; V_ENL <= 0.4 V places the device in standby (I_STBY typ 0.05 uA). Absolute maximum -0.3 V to 6.0 V; must not be left floating. |
| 5 | N/C | unconnected | Not internally connected. May be tied to the ground plane to improve thermal dissipation. |
| 6 | IN | power_in | Power supply input pin. Operating range 1.4 V to 5.5 V (absolute max -0.3 V to 6.0 V). Requires a 1 uF ceramic input capacitor placed close to the pin. |
| EPAD | EPAD | passive | Exposed thermal pad on the package underside. Recommended to connect to GND for improved thermal dissipation; leaving it floating is also acceptable per datasheet. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | XDFN-6-EP(1.2x1.2) |
| Category | PMIC |
| Pins | 7 |
Ordering variants
Same part, different packaging or reel option.
NCP176AMX330TCG
CAD (KiCad official)
- Symbol:
NCP176AMX330TCG - Footprint:
Package_DFN_QFN:DFN-6-1EP_1.2x1.2mm_P0.4mm_EP0.3x0.94mm_PullBack - 3D model: XDFN-6-EP(1.2x1.2) (KiCad packages3D, STEP)
- 3D model files:
ncp176amx330tcg-etched.step/ncp176amx330tcg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ncp176amx330tcg.step/ncp176amx330tcg.glbare the bare package body.
3D model downloads
Two STEP files. Same geometry, different body top:
| File | Size | Use it when |
|---|---|---|
ncp176amx330tcg.step |
85 KB | You want the bare part, or you mark your own boards. |
ncp176amx330tcg-etched.step |
2.5 MB | You want the part with NCP176AMX330TCG already on it. |
The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 608 faces against 50 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (13 pp, sha256
3bc6fc227b27e50e, retrieved 2026-08-17, tier: manufacturer) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).