NCP130AMX120TCG
Public Made by Adomby adom
onsemi Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, XDFN-6-EP(1.2x1.2). Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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README
markdownNCP130AMX120TCG
onsemi · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · XDFN-6-EP(1.2x1.2)
NCP130AMX120TCG from onsemi, in a XDFN-6-EP(1.2x1.2). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | power_out | Regulated output voltage pin. Fixed 1.20 V nominal at up to 300 mA. Requires a ceramic output capacitor with effective capacitance of 1 µF to 10 µF for stability. When EN is low, an internal ~150 Ω active discharge (A-option) pulls this pin down. |
| 2 | NC | unconnected | Not internally connected. Leave floating or tie to ground. |
| 3 | EN | input | Enable input. Driving high (VIH ≥ 0.9 V) enables the regulator; driving low (VIL ≤ 0.4 V) puts the device into shutdown. Has an internal pull-down of ~0.3 µA (typ, 1 µA max at 5.5 V) and built-in hysteresis. Tie to VIN or VBIAS if enable function is not used. |
| 4 | BIAS | power_in | Bias supply for internal control circuitry. Operating range 2.4 V to 5.5 V (must be ≥ VOUT + 1.35 V). Monitored by internal UVLO (1.6 V rising, 0.2 V hysteresis). Typical quiescent current 80 µA; 0.5 µA typical in shutdown. Recommended 0.1 µF ceramic bypass capacitor to GND. |
| 5 | GND | power_in | Ground reference for the device. Connect to system ground plane; also bond to the exposed thermal pad for improved thermal performance. |
| 6 | IN | power_in | Main input voltage supply, routed through the internal NMOS pass transistor to OUT. Operating range 0.8 V to 5.5 V (must be ≥ VOUT + VDO, where VDO ≤ 150 mV at 300 mA). Recommended 1 µF ceramic bypass capacitor to GND. |
| PAD | EPAD | passive | Exposed thermal pad on the underside of the package. Should be soldered to the ground plane for improved thermal dissipation (RθJA = 170 °C/W). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | XDFN-6-EP(1.2x1.2) |
| Category | PMIC |
| Pins | 7 |
Ordering variants
Same part, different packaging or reel option.
NCP130AMX120TCGAMX080TCGNCP130AMX120TCGAMX090TCGNCP130AMX100TCGNCP130AMX105TCGNCP130AMX110TCGNCP130AMX115TCGNCP130AMX120TCGNCP130AMX150TCGNCP130AMX170TCGNCP130AMX180TCGNCP130AMX120TCGAMX210TCGNCP130AMX120TCGBMX080TCGNCP130AMX120TCGBMX090TCGNCP130AMX120TCGBMX100TCGNCP130AMX120TCGBMX105TCGNCP130AMX120TCGBMX110TCGNCP130AMX120TCGBMX115TCGNCP130AMX120TCGBMX120TCGNCP130AMX120TCGBMX150TCGNCP130AMX120TCGBMX170TCGNCP130AMX120TCGBMX180TCGNCP130AMX120TCGBMX210TCG
CAD (KiCad official)
- Symbol:
NCP130AMX120TCG - Footprint:
Package_DFN_QFN:DFN-6-1EP_1.2x1.2mm_P0.4mm_EP0.3x0.94mm_PullBack - 3D model: XDFN-6-EP(1.2x1.2) (KiCad packages3D, STEP)
3D model downloads
Two STEP files. Same geometry, different body top:
| File | Size | Use it when |
|---|---|---|
ncp130amx120tcg.step |
85 KB | You want the bare part, or you mark your own boards. |
ncp130amx120tcg-etched.step |
2.4 MB | You want the part with NCP130AMX120TCG already on it. |
The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 601 faces against 50 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (10 pp, sha256
d1ec1fb42795239c, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).