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MD8312

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Shanghai Mingda Microelectronics Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, SOT-89-3. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

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Contents

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MD8312

Shanghai Mingda Microelectronics · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-89-3

MD8312 from Shanghai Mingda Microelectronics, in a SOT-89-3. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOUT power_out Regulated 12V output. Drive with a >=1.0uF low-ESR ceramic capacitor to GND placed close to the pin. Maximum output current 300mA (typ), current-limited around 550mA with foldback. Must not exceed VIN+0.3V or the internal parasitic diode will conduct.
2 GND power_in Device ground / return. Quiescent GND current is ~1.5uA (no load) and rises with IOUT (typ 460uA at IOUT=100mA). SOT89 heat-slug tab; connect to the ground plane for thermal dissipation (PD=1000mW, RθJB=100 °C/W).
3 VIN power_in Unregulated input supply, 2.2V to 40V (absolute max 45V). Bypass with a >=1.0uF ceramic capacitor to GND close to the pin to avoid oscillation. For the 12V output variant VIN must be at least VOUT + dropout (~1.3V typ at 300mA).

Key specifications

Parameter Value
Manufacturer Shanghai Mingda Microelectronics
Package SOT-89-3
Category PMIC
Pins 3

Ordering variants

Same part, different packaging or reel option.

  • MD8312
  • MD8312A

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output voltage accuracy VOUT -2 2 % 2
Input Voltage VIN 2.2 40 V 3
GND Current IGND 1.5 2.3 3.5 uA no load, VOUT(S)>5.3V 3
Load Regulation VOUT 50 80 mV VIN=VOUT(S)+2V, 1mA≤IOUT≤300mA, VOUT(S)>5.3V 3
Line Regulation ΔVOUT/ΔVIN 0.01 0.02 %/V VOUT(S)+2V≤VIN≤40V, IOUT=1mA 3
Temperature Stability -50 50 ppm/℃ VIN = VOUT(S)+2V, IOUT=10mA, -40℃≤Ta≤125℃ 3
Maximum Output Current IOUTMAX 300 350 mA 3
Current Limit ILIM 350 550 mA VIN= VOUT(S)+2V, VOUT = 0.95×VOUT(S) 3
Thermal Resistance Junction-to-Board RθJB 100 ℃/W SOT89-3, mounted on JEDEC standard 4-layer (2s2p) PCB 2
Input Voltage (absolute maximum) VIN -0.3 45 V 2
Power Dissipation PD 1000 mW SOT89-3 2
Operating Ambient Temperature Topr -40 85 ℃ 2
Storage Temperature Tstg -40 125 ℃ 2
ESD Protection ESD HBM 1500 V HBM 2

CAD (KiCad official)

  • Symbol: MD8312
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89-3 (KiCad packages3D, STEP)
  • 3D model files: md8312-etched.step / md8312-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); md8312.step / md8312.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shanghai Mingda Microelectronics datasheet (10 pp, sha256 b90bf74c0495d786, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF