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MCP2561T-E

Microchip · CAN Controllers · SOIC-8

MCP2561T-E from Microchip, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 TXD input Transmit data input from the CAN protocol controller. A logic-low on TXD drives the bus to the dominant state; a logic-high (or floating) allows the bus to relax to recessive. CMOS-compatible input referenced to VDD (5 V nominal).
2 VSS power_in Ground reference (0 V) for the transceiver. Connect to the system ground plane close to the device.
3 VDD power_in Positive supply input, nominally 5 V. Decouple with a 0.1 µF ceramic capacitor to VSS placed close to the pin.
4 RXD output Receive data output to the CAN protocol controller. Reports the received bus state: logic-low = dominant, logic-high = recessive. CMOS push-pull output referenced to VDD.
5 SPLIT output Common-mode stabilization output for split-termination networks (nominally VDD/2). Tied to the midpoint of two 60 Ω termination resistors (with a small filter capacitor to VSS) to reduce common-mode emissions on the CAN bus. May be left unconnected if a standard single 120 Ω termination is used.
6 CANL bidirectional CAN bus low-side differential I/O. Driven low in the dominant state and biased to VDD/2 in the recessive state. Withstands ±58 V bus faults (ISO 11898-5).
7 CANH bidirectional CAN bus high-side differential I/O. Driven high in the dominant state and biased to VDD/2 in the recessive state. Withstands ±58 V bus faults (ISO 11898-5).
8 STBY input Standby mode control input. Normal Operation when VIL < 0.3 VDD (tie low or drive low); Standby (low-power) mode when VIH > 0.7 VDD (float, pull up, or drive high). Includes an internal worst-case pull-up of ~500 kΩ, so any external pull-down resistor must be < 100 kΩ to guarantee VIL.

Key specifications

Parameter Value
Manufacturer Microchip
Package SOIC-8
Category Interface
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • MCP2561T-EE/SN
  • MCP2561T-E/SN
  • MCP2561T-EH/SN
  • MCP2561T-ET-H/SN
  • MCP2561T-EE/P
  • MCP2561T-EH/P
  • MCP2561T-EE/MF
  • MCP2561T-E/MF
  • MCP2561T-EH/MF
  • MCP2561T-ET-H/MF

CAD (KiCad official)

  • Symbol: MCP2561T-E
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
mcp2561t-e.step 122 KB You want the bare part, or you mark your own boards.
mcp2561t-e-etched.step 1.8 MB You want the part with MCP2561T-E already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 463 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip datasheet (6 pp, sha256 f65446651abab422, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF