MAX202EIN from HGSEMI, in a DIP-16. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	C1+	passive	Positive terminal of charge-pump flying capacitor C1 (0.1 µF, 16 V). Connect to pin 3 (C1-) with a ceramic capacitor.
2	V+	power_out	Positive charge-pump output, nominally +10 V (VCC-0.3 V to 14 V absolute max). Bypass to GND with a 0.1-µF capacitor (6.3 V or higher).
3	C1-	passive	Negative terminal of charge-pump flying capacitor C1 (0.1 µF). Connect to pin 1 (C1+).
4	C2+	passive	Positive terminal of charge-pump flying capacitor C2 (0.1 µF, 16 V). Connect to pin 5 (C2-).
5	C2-	passive	Negative terminal of charge-pump flying capacitor C2 (0.1 µF). Connect to pin 4 (C2+).
6	V-	power_out	Negative charge-pump output, nominally -10 V (-14 V to 0.3 V absolute max). Bypass to GND with a 0.1-µF capacitor (16 V).
7	DOUT2	output	RS-232 driver 2 output. Inverted TTL/CMOS input from DIN2; swings between V+ and V- (nominally ±10 V) with ≥30-V/µs slew rate. ±15-kV HBM ESD-protected RS-232 bus pin.
8	RIN2	input	RS-232 receiver 2 input. Accepts ±30-V RS-232 levels with ~5-kΩ input resistance and hysteresis (VIT+ typ 1.7 V, VIT- typ 1.2 V). ±15-kV HBM ESD-protected RS-232 bus pin.
9	ROUT2	output	TTL/CMOS receiver 2 output (inverted from RIN2). Swings from GND to near VCC; drives host UART RX.
10	DIN2	input	TTL/CMOS driver 2 input. VIH ≥ 2 V, VIL ≤ 0.8 V; drives DOUT2 (inverted) to RS-232 levels.
11	DIN1	input	TTL/CMOS driver 1 input. VIH ≥ 2 V, VIL ≤ 0.8 V; drives DOUT1 (inverted) to RS-232 levels.
12	ROUT1	output	TTL/CMOS receiver 1 output (inverted from RIN1). Swings from GND to near VCC; drives host UART RX.
13	RIN1	input	RS-232 receiver 1 input. Accepts ±30-V RS-232 levels with ~5-kΩ input resistance and hysteresis (VIT+ typ 1.7 V, VIT- typ 1.2 V). ±15-kV HBM ESD-protected RS-232 bus pin.
14	DOUT1	output	RS-232 driver 1 output. Inverted TTL/CMOS input from DIN1; swings between V+ and V- (nominally ±10 V) with ≥30-V/µs slew rate. ±15-kV HBM ESD-protected RS-232 bus pin.
15	GND	power_in	Device ground / signal reference for all voltages.
16	VCC	power_in	+5-V supply input (recommended 4.5 V to 5.5 V, absolute max 6 V). Typical ICC ≈ 8 mA (no load, 15 mA max). Bypass to GND with at least 0.1 µF.

Key specifications

Parameter	Value
Manufacturer	HGSEMI
Package	DIP-16
Category	Interface
Pins	16

Ordering variants

Same part, different packaging or reel option.

MAX202EIN
MAX202ECN
MAX202EIM/TR
MAX202ECM/TR
MAX202EIMT/TR
MAX202ECMT/TR

CAD (KiCad official)

Symbol: MAX202EIN
Footprint: Package_DIP:DIP-16_W7.62mm
3D model: DIP-16 (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File	Size	Use it when
`max202ein.step`	505 KB	You want the bare part, or you mark your own boards.
`max202ein-etched.step`	2.1 MB	You want the part with `MAX202EIN` already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 553 faces against 284 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: HGSEMI datasheet (13 pp, sha256 d669a5a448fb5d49, retrieved 2026-08-17, tier: lcsc)
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF