LM13700MX from Texas Instruments TI, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	AMP_BIAS_INPUT_A	input	Amplifier bias current (IABC) input for channel A. Sets forward transconductance gm; recommended IABC up to 2 mA max. Typical gm ≈ 9600 μS at IABC = 500 μA.
2	DIODE_BIAS_A	input	Linearizing diode bias input for channel A. Injecting ID (max 2 mA) forward-biases the internal diode pair to reduce distortion at higher input levels.
3	IN+_A	input	Non-inverting (positive) differential input of transconductance amplifier A. Common-mode range ±13.5 V typ at ±15 V supplies; differential input voltage ±5 V max.
4	IN-_A	input	Inverting (negative) differential input of transconductance amplifier A. Same electrical limits as IN+.
5	OUT_A	output	Unbuffered current output of transconductance amplifier A. IOUT = gm · Vdiff; peak output current typ 500 μA at IABC = 500 μA. Usually fed to buffer input (pin 7).
6	V-	power_in	Negative supply. Dual-supply range −16 V to −4.75 V; total supply voltage up to 36 VDC (or ±18 V). Shared by both channels.
7	BUF_IN_A	input	Darlington buffer amplifier input for channel A. Typical buffer input bias current 0.5 μA (2 μA max). High-impedance buffer input, typically tied to OUT_A.
8	BUF_OUT_A	output	Darlington buffer amplifier output for channel A. Peak buffer output voltage typ 10 V; buffer output current limited to 20 mA absolute maximum.
9	BUF_OUT_B	output	Darlington buffer amplifier output for channel B. Peak buffer output voltage typ 10 V; buffer output current limited to 20 mA absolute maximum.
10	BUF_IN_B	input	Darlington buffer amplifier input for channel B. Typical buffer input bias current 0.5 μA (2 μA max). High-impedance buffer input, typically tied to OUT_B.
11	V+	power_in	Positive supply. Single-supply range 9.5 V to 32 V; dual-supply range 4.75 V to 16 V. Shared by both channels.
12	OUT_B	output	Unbuffered current output of transconductance amplifier B. IOUT = gm · Vdiff; peak output current typ 500 μA at IABC = 500 μA.
13	IN-_B	input	Inverting (negative) differential input of transconductance amplifier B. Differential input voltage ±5 V max; DC input voltage clamped between +Vs and −Vs.
14	IN+_B	input	Non-inverting (positive) differential input of transconductance amplifier B. Common-mode range ±13.5 V typ at ±15 V supplies.
15	DIODE_BIAS_B	input	Linearizing diode bias input for channel B. Injecting ID (max 2 mA) forward-biases the internal diode pair to reduce distortion at higher input levels.
16	AMP_BIAS_INPUT_B	input	Amplifier bias current (IABC) input for channel B. Sets forward transconductance gm; recommended IABC up to 2 mA max.

Key specifications

Parameter	Value
Manufacturer	Texas Instruments TI
Package	SOIC-16
Category	Op-amp/Cmp
Pins	16

Ordering variants

Same part, different packaging or reel option.

LM13700MXM
LM13700MX
LM13700MXN

CAD (KiCad official)

Symbol: LM13700MX
Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
3D model: SOIC-16 (KiCad packages3D, STEP)

3D model downloads

Two STEP files. Same geometry, different body top:

File	Size	Use it when
`lm13700mx.step`	217 KB	You want the bare part, or you mark your own boards.
`lm13700mx-etched.step`	2.1 MB	You want the part with `LM13700MX` already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 548 faces against 267 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Texas Instruments TI datasheet (37 pp, sha256 442acd3669dc439f, retrieved 2026-08-17, tier: manufacturer)
Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF