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Contents

README

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HMC903LP3ETR

Analog Devices · RF Amplifiers · LFCSP-16-EP(3x3)

HMC903LP3ETR from Analog Devices, in a LFCSP-16-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NIC unconnected Not Internally Connected; all characterization data measured with this pin grounded externally.
2 GND power_in Ground pin; must connect to RF/dc ground with low inductance.
3 RFIN input AC-coupled RF Input matched to 50 Ω.
4 NIC unconnected Not Internally Connected; all characterization data measured with this pin grounded externally.
5 NIC unconnected Not Internally Connected; all characterization data measured with this pin grounded externally.
6 VGG1 input Optional Gate Control for Amplifier (voltage range −2 V to +0.2 V); if open, runs self-biased; negative voltage reduces drain current.
7 VGG2 input Optional Gate Control for Amplifier (voltage range −2 V to +0.2 V); if open, runs self-biased; negative voltage reduces drain current.
8 NIC unconnected Not Internally Connected; all characterization data measured with this pin grounded externally.
9 NIC unconnected Not Internally Connected; all characterization data measured with this pin grounded externally.
10 RFOUT output AC-coupled RF Output matched to 50 Ω.
11 GND power_in Ground pin; must connect to RF/dc ground with low inductance.
12 NIC unconnected Not Internally Connected; all characterization data measured with this pin grounded externally.
13 NIC unconnected Not Internally Connected; all characterization data measured with this pin grounded externally.
14 VDD1 power_in Power Supply Voltage for the Amplifier; 3.5 V typical with required external bypass capacitors.
15 VDD2 power_in Power Supply Voltage for the Amplifier; 3.5 V typical with required external bypass capacitors.
16 NIC unconnected Not Internally Connected; all characterization data measured with this pin grounded externally.
17 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Analog Devices
Package LFCSP-16-EP(3x3)
Category RF And Wireless
Pins 17

CAD (KiCad official)

  • Symbol: HMC903LP3ETR
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: LFCSP-16-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: hmc903lp3etr-etched.step / hmc903lp3etr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hmc903lp3etr.step / hmc903lp3etr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (13 pp, sha256 ac60d66d06b2b81e, retrieved 2026-09-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF