component
H9108
Public Made by Adomby adom
Shanghai Siproin Microelectronics DC-DC Converters, SOT-23-6. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownH9108
Shanghai Siproin Microelectronics · DC-DC Converters · SOT-23-6
H9108 from Shanghai Siproin Microelectronics, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BS | passive | Bootstrap pin for the high-side N-MOSFET gate driver. A bootstrap capacitor (typically 22nF ceramic) is connected between BS and SW to form a floating supply that boosts the high-side switch gate above VIN. |
| 2 | GND | power_in | Device ground reference. Should be connected to a large copper area for thermal dissipation and to serve as the return for the input capacitor, output capacitor, and feedback divider. |
| 3 | FB | input | Feedback input to the error amplifier. Connect to the center tap of an external resistor divider from VOUT to GND; the regulator servos FB to the internal 0.6V reference (VOUT = 0.6V x (R1+R2)/R2). |
| 4 | EN | input | Enable input. Drive high (VENH >= 1.4V) to enable the converter; drive low (VENL <= 0.9V) to disable and enter micro-power shutdown (~4uA). Can be tied to VIN through a pull-up resistor (e.g. 100k) for auto-start. |
| 5 | IN | power_in | Power supply input, 4V to 18V (absolute max 18V, -0.3V min). Bypass with a low-ESR ceramic capacitor placed close to the pin (typ. 22uF). |
| 6 | SW | output | Switch node output. Common drain of the internal high-side and low-side MOSFETs; connect to the external inductor. Rated -0.3V to (VIN+0.5V); high-side RDS(on) ~100mOhm, low-side ~70mOhm. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shanghai Siproin Microelectronics |
| Package | SOT-23-6 |
| Category | PMIC |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Voltage Range | 4 | 18 | V | 4 | |||
| EN Voltage High | VENH | 1.4 | V | 4 | |||
| EN Voltage Low | VENL | 0.9 | V | 4 | |||
| Regulated Feedback Voltage | VFB | 0.588 | 0.6 | 0.612 | V | TA = 25℃, 4V≤VIN ≤18V | 4 |
| Supply Current in Operation | IQ | 0.5 | 0.6 | mA | VEN=3.0V, VFB=1.1V | 4 | |
| Supply Current in Shutdown | 4 | uA | VEN =0 or EN = GND | 4 | |||
| High-Side Switch On-Resistance | 100 | mΩ | 4 | ||||
| Low-Side Switch On-Resistance | 70 | mΩ | 4 | ||||
| High-Side Switch Leakage Current | 0 | 10 | uA | VEN=0V, VSW=0V | 4 | ||
| Upper Switch Current Limit | 3 | A | Minimum Duty Cycle | 4 | |||
| Oscillation Frequency | 0.6 | MHz | 4 | ||||
| Maximum Duty Cycle | 92 | % | VFB=0.6V | 4 | |||
| Minimum On-Time | 60 | nS | 4 | ||||
| Minimum Off-Time | 90 | nS | 4 | ||||
| Thermal Shutdown | 160 | ℃ | 4 | ||||
| Thermal Hysteresis | 20 | ℃ | 4 | ||||
| Input Supply Voltage | VIN | -0.3 | 18 | V | 3 | ||
| FB Voltages | VFB | -0.3 | 6 | V | 3 | ||
| Operating Temperature Range | TA | -40 | 85 | ℃ | 3 | ||
| Storage Temperature Range | TSTG | -65 | 150 | ℃ | 3 | ||
| Lead Temperature (Soldering, 10s) | 300 | ℃ | Soldering, 10s | 3 |
CAD (KiCad official)
- Symbol:
H9108 - Footprint:
Package_TO_SOT_SMD:SOT-23-6 - 3D model: SOT-23-6 (KiCad packages3D, STEP)
- 3D model files:
h9108-etched.step/h9108-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);h9108.step/h9108.glbare the bare package body.
3D model downloads
Two STEP files. Same geometry, different body top:
| File | Size | Use it when |
|---|---|---|
h9108.step |
97 KB | You want the bare part, or you mark your own boards. |
h9108-etched.step |
1.4 MB | You want the part with H9108 already on it. |
The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 332 faces against 117 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Shanghai Siproin Microelectronics datasheet (10 pp, sha256
d888f77e06c51893, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).