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Contents

README

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ETA9351Q4Y

etasolution · Power Management - Specialized · QFN-24L-EP(4x4)

ETA9351Q4Y from etasolution, in a QFN-24L-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 PGND3 power_in Power ground for Channel 3 buck converter. Return path for the low-side NMOS switch current; route with a low-impedance connection to the input/output capacitor grounds.
2 EN3 input Enable input for Channel 3. Drive high (>1.5 V) to enable the channel, low (<0.4 V) to disable. EN input current ~1 uA.
3 NC unconnected No internal connection. Per the PCB Layout Guide (page 7) this pin is used as a routing island; PGND2 (pin 11) is jumpered through the exposed pad to pin 3 to shorten the Channel 2 input capacitor return path.
4 VIN2 power_in Input supply voltage for Channel 2 (2.6 V to 5.5 V). Bypass with a 22 uF ceramic capacitor to PGND2 and a 10 nF capacitor to AGND2.
5 SW2 output Switching node for Channel 2. Connect a 1 uH inductor between SW2 and VOS2. Internally driven by the high-side PMOS and low-side NMOS power switches; SW current is internally limited (~4.5 A typ).
6 EN2 input Enable input for Channel 2. Drive high (>1.5 V) to enable the channel, low (<0.4 V) to disable.
7 VIN1 power_in Input supply voltage for Channel 1 (2.6 V to 5.5 V). Bypass with a 22 uF ceramic capacitor to PGND1 and a 10 nF capacitor to AGND1.
8 EN1 input Enable input for Channel 1. Drive high (>1.5 V) to enable the channel, low (<0.4 V) to disable.
9 PGND1 power_in Power ground for Channel 1 buck converter. Return path for the low-side NMOS switch current.
10 SW1 output Switching node for Channel 1. Connect a 1 uH inductor between SW1 and VOS1.
11 PGND2 power_in Power ground for Channel 2 buck converter. Per the PCB Layout Guide, route through the bottom exposed heat-dissipation pad over to pin 3 to shorten the Channel 2 input capacitor return path.
12 FB1 input Feedback input for Channel 1. Connect an external resistor divider from VOUT1 to FB1 and AGND1 to program the output between 0.45 V and VIN1. Regulation threshold is 0.45 V (0.441 V / 0.459 V min/max); input current ~0.01 uA.
13 AGND1 power_in Analog ground for Channel 1. Keep quiet by adding a 10 nF ceramic capacitor from VIN1 to AGND1.
14 VOS1 input Output voltage sense input for Channel 1. Connect directly to the Channel 1 regulated output node (post-inductor) for the internal on-time / voltage-mode control loop.
15 FB2 input Feedback input for Channel 2. Connect an external resistor divider from VOUT2 to FB2 and AGND2 to program the output between 0.45 V and VIN2.
16 AGND2 power_in Analog ground for Channel 2. Add a 10 nF ceramic capacitor from VIN2 to AGND2 to keep this reference quiet.
17 VOS2 input Output voltage sense input for Channel 2. Connect directly to the Channel 2 regulated output node.
18 FB3 input Feedback input for Channel 3. Connect an external resistor divider from VOUT3 to FB3 and AGND3 to program the output between 0.45 V and VIN3.
19 AGND3 power_in Analog ground for Channel 3. Add a 10 nF ceramic capacitor from VIN3 to AGND3 to keep this reference quiet.
20 VOS3 input Output voltage sense input for Channel 3. Connect directly to the Channel 3 regulated output node.
21 PG3 output Power-Good open-drain output for Channel 3. High-impedance when VOUT3 is within regulation (rising threshold 90% of nominal, 2.5% hysteresis); pulls low (VOL <=0.4 V at 1 mA sink) when VOUT3 is below its nominal value. The external pull-up must not exceed VIN3.
22 SW3 output Switching node for Channel 3. Connect a 1 uH inductor between SW3 and VOS3.
23 PVIN3 power_in Power input supply for Channel 3 (2.6 V to 5.5 V). Feeds the Channel 3 high-side PMOS power switch. Bypass with a 22 uF ceramic capacitor to PGND3 and a 10 nF capacitor to AGND3; tie together with AVIN3.
24 AVIN3 power_in Analog input supply for Channel 3 (2.6 V to 5.5 V). Feeds the Channel 3 analog/control circuitry. Bypass with a 22 uF ceramic capacitor to PGND3 and a 10 nF capacitor to AGND3; typically tied to PVIN3.
25 GND power_in Exposed thermal pad on the bottom of the QFN-24 package. Must be soldered to the PCB ground plane for electrical ground and thermal dissipation (theta-JA = 30 degC/W). Also serves as a routing plane between PGND2 (pin 11) and pin 3 per the PCB Layout Guide.

Key specifications

Parameter Value
Manufacturer etasolution
Package QFN-24L-EP(4x4)
Category Power Management (PMIC)
Pins 25

Ordering variants

Same part, different packaging or reel option.

  • ETA9351Q4Y

CAD (KiCad official)

  • Symbol: ETA9351Q4Y
  • Footprint: Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm
  • 3D model: QFN-24L-EP(4x4) (KiCad packages3D, STEP)
  • 3D model files: eta9351q4y-etched.step / eta9351q4y-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); eta9351q4y.step / eta9351q4y.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: etasolution datasheet (9 pp, sha256 b31a7ee0be5fc574, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF