TPS54202 12 V to 5 V / 1 A Synchronous Buck Converter Molecule

@@ -67,4 +67,6 @@ Every step of the build, in order, each with its own page of evidence (checks, s  **14. Routing**: every trace routed, DRC clean. [The evidence](steps/14-routing/README.md) +**15. Heatsink vias**: via arrays under the hot parts. [The evidence](steps/15-thermal-vias/README.md)+ <!-- /aiflow:steps -->

@@ -0,0 +1,31 @@+# Step 15: Heatsink vias++Heatsink vias where the heat is: for every part that dissipates real power (the regulator, the inductor, the catch diode, the FETs), an array of vias in its thermal pad or the copper it dumps heat into, stitched to the ground or the plane on the other side, sized and counted from its dissipation; the AI reviews the plan and the binary lands it.++## Visits++- 2026-10-18T20:45:27Z++## What the binary checked++### thermal-vias++- **acked**: L1, U1+- **landed**: 0+- **short**: 0 item(s)++### thermal-vias-plan++- **parts**: 2 item(s)+- **plan**: ./aiflow-run/plan-thermal-vias.json+- **pourFreshness**: note: pour VIN input rail pour F.Cu (VIN F.Cu) is not on the board yet (never landed); vias are counted against the planned outline e35784247391, note: pour VOUT output rail pour F.Cu (VOUT F.Cu) is not on the board yet (never landed); vias are counted against the planned outline bb685bb7846d, note: pour SW compact low-EMI patch F.Cu (SW F.Cu) is not on the board yet (never landed); vias are counted against the planned outline fa04a8663f1d++## Screenshots and drawings++**start**++![start](shot-thermal-vias-1-start.png)++**visit 1-start**++![visit 1-start](shot-thermal-vias-1-start.png)