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adom-aiflow: step evidence (thermal-vias)

John Lauer ·d39ba29b70 ·2d ago ·parent 2a1c88f
1 file changed +22−1
steps/15-thermal-vias/README.md+22−1
@@ -5,6 +5,7 @@ Heatsink vias where the heat is: for every part that dissipates real power (the ## Visits  - 2026-10-18T20:45:27Z+- 2026-10-18T22:04:09Z  ## What the binary checked @@ -18,7 +19,7 @@ Heatsink vias where the heat is: for every part that dissipates real power (the  - **parts**: 2 item(s) - **plan**: ./aiflow-run/plan-thermal-vias.json-- **pourFreshness**: note: pour VIN input rail pour F.Cu (VIN F.Cu) is not on the board yet (never landed); vias are counted against the planned outline e35784247391, note: pour VOUT output rail pour F.Cu (VOUT F.Cu) is not on the board yet (never landed); vias are counted against the planned outline bb685bb7846d, note: pour SW compact low-EMI patch F.Cu (SW F.Cu) is not on the board yet (never landed); vias are counted against the planned outline fa04a8663f1d+- **pourFreshness**: 0 item(s)  ## Screenshots and drawings @@ -26,6 +27,26 @@ Heatsink vias where the heat is: for every part that dissipates real power (the  ![start](shot-thermal-vias-1-start.png) +**end**++![end](shot-thermal-vias-1-end.png)++**start**++![start](shot-thermal-vias-2-start.png)++**visit 1-end**++![visit 1-end](shot-thermal-vias-1-end.png)+ **visit 1-start**  ![visit 1-start](shot-thermal-vias-1-start.png)++**visit 2-start**++![visit 2-start](shot-thermal-vias-2-start.png)++## AI usage (Google Antigravity)++50 model calls: 152,858 fresh input, 7,099,210 cached input and 41,622 output tokens.