OCuLink Riser for the Supermicro AIOM Slot

@@ -1,6 +1,6 @@ # AI Flow run: claude on board-0 -**Running**: step `thermal`, 220.7 min of AI time since the prompt (527.4 min on the wall clock). This page updates at every step change.+**Running**: step `fields`, 221.5 min of AI time since the prompt (528.2 min on the wall clock). This page updates at every step change.  Prompt at 2026-10-12T21:19:30Z (UTC). Flow: board. Every number here is from the run's append-only ledger (run.jsonl). AI time is the time the AI was working on a prompt: from the human's prompt to the AI's done, with any gap over 15 min where no command ran (unobserved, not proven idle) cut out. @@ -10,8 +10,8 @@ One row per human prompt: the AI's time on it, unobserved gaps excluded by the h  | Session | Prompt at | Done at | AI time min | Unobserved gap min | What | |---|---|---|---|---|---|-| 1 | 2026-10-12T21:19:30Z | (open) | 220.7 | 307 | the first prompt |-| **all** | | | **220.7** | | |+| 1 | 2026-10-12T21:19:30Z | (open) | 221.4 | 307 | the first prompt |+| **all** | | | **221.5** | | |  ## Per step @@ -21,18 +21,19 @@ AI time only, the idle cut out. |---|---|---|---|---|---|---|---| | intake | 24.4 | 24.4 | 0.0 | 2 | 1 | 0 | 23.9 min | | placement | 20.9 | 8.1 | 12.8 | 17 | 3 | 2 | 5.7 min |-| routing | 98.5 | 7.2 | 91.3 | 32 | 3 | 0 | 4.8 min |+| routing | 99.2 | 7.2 | 92.0 | 32 | 3 | 0 | 4.8 min | | pours | 0.9 | 0.0 | 0.9 | 5 | 1 | 0 | 0.0 min | | current | 42.6 | 0.0 | 42.6 | 21 | 1 | 0 | 0.0 min |-| thermal | 0.0 | 0.0 | 0.0 | 1 | 1 | 0 | 0.0 min |+| thermal | 0.1 | 0.0 | 0.1 | 4 | 1 | 0 | 0.0 min | | components | 10.8 | 7.5 | 3.3 | 9 | 1 | 0 | 6.0 min |+| fields | 0.0 | 0.0 | 0.0 | 1 | 1 | 0 | 0.0 min | | libraries | 4.6 | 4.6 | 0.1 | 1 | 1 | 0 | 4.6 min | | models | 6.2 | 3.4 | 2.8 | 6 | 1 | 0 | 2.0 min | | outline | 0.2 | 0.0 | 0.2 | 2 | 1 | 0 | 0.0 min | | rules | 0.3 | 0.3 | 0.0 | 7 | 1 | 0 | 0.2 min | | test-plan | 11.0 | 9.2 | 1.8 | 5 | 1 | 0 | 9.1 min | | thermal-vias | 0.1 | 0.0 | 0.1 | 4 | 1 | 0 | 0.0 min |-| **total** | **220.7** | **64.8** | **155.9** | | | | |+| **total** | **221.4** | **64.8** | **156.7** | | | | |  ## Returns to earlier steps @@ -59,10 +60,13 @@ AI time only, the idle cut out. - 2026-10-13T04:10:41Z clip guard: the current clip ran 21 min, past its 10 min budget twice over; stopped by the guard - 2026-10-13T06:06:47Z artifact analysis-image for current-1: DC current density on all six copper layers: the 0.1 A +3V3 aux load peaks at 47 A/mm² on a 0.2 mm In4 trace, under the 60 A/mm² limit; 3 mW of Joule loss - 2026-10-13T06:06:53Z clip-start:thermal-1+- 2026-10-13T06:07:29Z artifact analysis-image for thermal-1: Heat flow in the copper, layer by layer: no part dissipates real power; the 3 mW Joule loss spreads into the ground pours and vias+- 2026-10-13T06:07:29Z artifact analysis-image for thermal-1: Temperature rise over the card: at most 66 mK in still air, 49 mK in moving air, against a 10 C budget  ## Where the board stands  - analyze-current: pass+- analyze-thermal: pass  ## The steps on camera @@ -258,12 +262,26 @@ What this step does: IPC-2221 on every loaded net, pour and via capacity, the sa  What this step does: copper and vias at every hot tab against the rise budget; then the AI's own temperature rise drawing and a walkthrough of the pours it judged +**This clip filmed nothing usable: no frames. It is kept as evidence and left out of the video.**+ **Clip: thermal, still recording (started 2026-10-13T06:06:53Z); it appears here when the step ends.**  **Screenshot: the board when thermal began.**  ![the board when thermal began](/blob/app/oculink-aiom-riser/docs/runs/ocp-oculink-riser-claude-20261012-2119/shot-thermal-1-start.png) +**Screenshot: the board when thermal ended.**++![the board when thermal ended](/blob/app/oculink-aiom-riser/docs/runs/ocp-oculink-riser-claude-20261012-2119/shot-thermal-1-end.png)++**The AI's drawing: Heat flow in the copper, layer by layer: no part dissipates real power; the 3 mW Joule loss spreads into the ground pours and vias**++![Heat flow in the copper, layer by layer: no part dissipates real power; the 3 mW Joule loss spreads into the ground pours and vias](/blob/app/oculink-aiom-riser/docs/runs/ocp-oculink-riser-claude-20261012-2119/thermal-1-analysis-image-0.png)++**The AI's drawing: Temperature rise over the card: at most 66 mK in still air, 49 mK in moving air, against a 10 C budget**++![Temperature rise over the card: at most 66 mK in still air, 49 mK in moving air, against a 10 C budget](/blob/app/oculink-aiom-riser/docs/runs/ocp-oculink-riser-claude-20261012-2119/thermal-1-analysis-image-1.png)+ ## Plan usage, the second cost line  Percent of each plan limit used, as the provider reports it, at the start of the run and at its end.