board
OCuLink Riser for the Supermicro AIOM Slot
Public Unreviewedby John Lauer
Passive OCP NIC 3.0 SFF card that breaks a Supermicro AIOM slot's PCIe x16 into four OCuLink 4i ports (4 x4, Gen4): 6-layer, 85 ohm, length-matched, DRC-clean KiCad project with Gerbers, BOM and CPL.
← Commit history
aiflow run ocp-oculink-riser-claude-20261012-2119: current
3 files changed
+23−5
docs/runs/ocp-oculink-riser-claude-20261012-2119/README.md+23−5@@ -1,6 +1,6 @@ # AI Flow run: claude on board-0 -**Running**: step `outline`, 164.9 min of AI time since the prompt (389.7 min on the wall clock). This page updates at every step change.+**Running**: step `current`, 165.0 min of AI time since the prompt (389.8 min on the wall clock). This page updates at every step change. Prompt at 2026-10-12T21:19:30Z (UTC). Flow: board. Every number here is from the run's append-only ledger (run.jsonl). AI time is the time the AI was working on a prompt: from the human's prompt to the AI's done, with any gap over 15 min where no command ran (unobserved, not proven idle) cut out. @@ -10,8 +10,8 @@ One row per human prompt: the AI's time on it, unobserved gaps excluded by the h | Session | Prompt at | Done at | AI time min | Unobserved gap min | What | |---|---|---|---|---|---|-| 1 | 2026-10-12T21:19:30Z | (open) | 164.9 | 225 | the first prompt |-| **all** | | | **164.9** | | |+| 1 | 2026-10-12T21:19:30Z | (open) | 165.0 | 225 | the first prompt |+| **all** | | | **165.0** | | | ## Per step @@ -23,14 +23,15 @@ AI time only, the idle cut out. | placement | 20.9 | 8.1 | 12.8 | 17 | 3 | 2 | 5.7 min | | routing | 85.5 | 7.2 | 78.3 | 32 | 3 | 0 | 4.8 min | | pours | 0.9 | 0.0 | 0.9 | 5 | 1 | 0 | 0.0 min |+| current | 0.0 | 0.0 | 0.0 | 1 | 1 | 0 | 0.0 min | | components | 10.8 | 7.5 | 3.3 | 9 | 1 | 0 | 6.0 min | | libraries | 4.6 | 4.6 | 0.1 | 1 | 1 | 0 | 4.6 min | | models | 6.2 | 3.4 | 2.8 | 6 | 1 | 0 | 2.0 min |-| outline | 0.0 | 0.0 | 0.0 | 1 | 1 | 0 | 0.0 min |+| outline | 0.2 | 0.0 | 0.2 | 2 | 1 | 0 | 0.0 min | | rules | 0.3 | 0.3 | 0.0 | 7 | 1 | 0 | 0.2 min | | test-plan | 11.0 | 9.2 | 1.8 | 5 | 1 | 0 | 9.1 min | | thermal-vias | 0.1 | 0.0 | 0.1 | 4 | 1 | 0 | 0.0 min |-| **total** | **164.9** | **64.8** | **100.1** | | | | |+| **total** | **165.0** | **64.8** | **100.3** | | | | | ## Returns to earlier steps @@ -53,6 +54,7 @@ AI time only, the idle cut out. - 2026-10-13T03:46:25Z clip-start:thermal-vias-1 - 2026-10-13T03:46:43Z clip-start:pours-1 - 2026-10-13T03:49:09Z clip-start:outline-1+- 2026-10-13T03:49:18Z clip-start:current-1 ## Where the board stands @@ -223,12 +225,28 @@ What this step does: pour every net the spec names, keepouts along Kelvin taps, What this step does: Round the board's corners: every sharp outline corner becomes a radius (1.0 mm by default, spec outline.cornerRadius), so the board is kind to hands, panels and the fab's router. +**This clip filmed nothing usable: no frames. It is kept as evidence and left out of the video.**+ **Clip: outline, still recording (started 2026-10-13T03:49:09Z); it appears here when the step ends.** **Screenshot: the board when outline began.**  +**Screenshot: the board when outline ended.**++++### current++What this step does: IPC-2221 on every loaded net, pour and via capacity, the same-layer rule; then the AI's own current density drawing and a walkthrough of the pours it judged++**Clip: current, still recording (started 2026-10-13T03:49:18Z); it appears here when the step ends.**++**Screenshot: the board when current began.**+++ ## Plan usage, the second cost line Percent of each plan limit used, as the provider reports it, at the start of the run and at its end.
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