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Hardware: components, molecules, projects, and equipment with symbols, footprints, and 3D models.

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FGH200MAAMD

FGH200MAAMD·Quectel·LGA-38, 11.0 x 10.0 x 2.0 mm, 1.0 mm pitch

3DSymFp

Quectel FGH200MAAMD (FGH200M) Wi-Fi HaLow IEEE 802.11ah module on the Morse Micro MM8108, 850 to 950 MHz, SDIO 2.0 / SPI and USB 2.0, 11.0 x 10.0 x 2.0 mm 38-pad LGA. Preliminary data. KiCad symbol, footprint, Fusion library and 3D.

adom · 2d ago

componentwifiwi-fi halow802.11ah

component adom

ZED-F9P-04B

ZED-F9P-04B·u-blox·LGA-54 (54 edge pads + 48 central GND pads), 22.0 x 17.0 x 2.4 mm

3DSymFp

u-blox ZED-F9P-04B multi-band (L1/L2) high precision RTK GNSS module, 17.0 x 22.0 x 2.4 mm LGA-54 with 48 central ground pads. KiCad symbol, footprint, Fusion library and 3D.

adom · 2d ago

componentgnssgpsrtk