Power Module - PM1
Power Module - PM1
J301-
J301-
J302-
J302-
J303-
J303-
J303+
J303+
J302+
J302+
J301+
J301+
Default Padstyle: EX55Y55D35P
Alt 1 Padstyle: OX60Y90D30P
Alt 2 Padstyle: OX90Y60D30P
0.1in/2.54mm
1.82in/46.228mm
0.1in/2.54mm
-0.059in/-1.499mm
-0.059in/-1.499mm
0.098in/2.489mm
0.195in/4.953mm
>Name
>Value
+
<b>Pin Headers,Terminal blocks-D-Sub-Backplane-FFC/FPC-Socket
<b>PIN HEADER</b>
>NAME
>VALUE
PIN HEADER
>NAME
>VALUE
>NAME
>VALUE
>NAME
>P3
>P1
>P2
Default Padstyle: OX53Y53D33P
1st Mtg Padstyle: RX110Y80D50P
2nd Mtg Padstyle: RX100Y300D70P
3rd Mtg Padstyle: RX100Y70D10P
Left Mtg Padstyle: EX60Y60D30P
Right Mtg Padstyle: EX60Y60D30P
Alt Padstyle 1: OX60Y90D30P
Alt Padstyle 2: OX90Y60D30P
0.079in/2mm
0.236in/5.994mm
0in/0mm
0.075in/1.9mm
0.287in/7.29mm
>Name
>Value
Adom Defaults for JLCPCB design rules (4 layers)
Board thickness: 1.6mm
Copper weight: 1oz (35um)
Track width spacing for 4-layer:
Multilayer: 0.09 / 0.09 mm (3.5 / 3.5 mil). 3 mil is acceptable in BGA fan-outs.
BGA pad diameter ≥ 0.25 mm
BGA pad to trace clearance min. 0.09 mm for multilayer boards
Vias can be placed within BGA pads using filled and plated-over vias
There are 2 net classes of:
These are valuable when using the auto-router if you tell it what wires are in the Power class
- Default (Min 0.09mm track width, Preferred 0.2mm)
- Power (Min 0.09mm track width, Preferred 0.3mm)
Min. track width and spacing (1 oz)
0.10 / 0.10 mm (4 / 4 mil)
Vias:
- Min 0.15mm via allowed on 4-layer now with JLC
- We made preferred 0.25mm, although JLC says 0.2 is preferred
Min. Via hole size/diameter 4-layer: 0.15mm hole size / 0.25mm via diameter
Drill:
Drill Diameter - 4-layer: 0.15 – 6.3 mm
Min. Non-plated holes - 0.50mm
Holes with diameter ≥ 6.3 mm are CNC routed from a smaller drilled hole.
Annular Ring:
Vias: 0.1mm annular ring is JLC min
Pads (through-hole parts): 0.18mm annular ring is JLC min
However, they prefer 0.25mm annular ring or above
Since Version 8.2, EAGLE supports online libraries. The ids
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Since Version 8.3, EAGLE supports URNs for individual library
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Since Version 8.3, EAGLE supports the association of 3D packages
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schematics, and board files. Those persistent groups
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