Heat Resistance
No damage, ΔL ≤ ±20%
85°C±2°C, 1000h (+48h/−0h)
Cold Resistance
No damage, ΔL ≤ ±20%
−40°C±2°C, 1000h (+48h/−0h)
Humidity
No damage, ΔL ≤ ±20%
40°C±2°C, 90–95% RH, 1000h (+48h/−0h)
Temperature Cycle
No damage, ΔL ≤ ±50%
−40°C±2°C (30min±3min) ↔ +85°C±2°C (30min±3min), 100 cycles
Soldering Heat
No damage, ΔL ≤ ±30%
270±5°C, 10s±1s immersion
Solderability
≥90% wetting
240±5°C, 3±1s, Sn-3.0Ag-0.5Cu
Vibration
No damage
10–2000Hz, 3.0mm or 245 m/s² (whichever smaller), 4h×3 axes (12h total)
Mechanical Shear
No damage, no electrode peeling
10N, 5s±1s
Bending Test
No damage, no electrode peeling
Glass-epoxy 100×40×1mm, 0.5mm/s, 2mm deflection, 30s hold
Drop Test
No damage
1m height, concrete/steel, 10 falls