High Temp Exposure
No damage, ΔL ≤ ±50%
150°C, 1000h (AEC-Q200)
Mechanical Shock
No damage, ΔL ≤ ±50%
100g, 6ms half-sine (AEC-Q200)
Biased Humidity
No damage, ΔL ≤ ±50%
85°C, 85% RH, 1000h (AEC-Q200)
Temperature Cycle
No damage, ΔL ≤ ±50%
−55°C ↔ +150°C, 1000 cycles (AEC-Q200)
Soldering Heat
No damage, ΔL ≤ ±30%
260°C, 10s immersion
Solderability
≥95% wetting
245°C, 3s, Sn-3.0Ag-0.5Cu
Vibration
ΔL within ±30%
10–2000Hz, 5g, 12 cycles×3 axes (AEC-Q200)
Terminal Strength
No damage
17.7N, 60s, parallel to PCB