Short Time Overload
ΔR ≤ ±(1.0% + 0.05Ω)
2.5× rated voltage, 5s
Load Life
ΔR ≤ ±(1.0% + 0.1Ω)
1000h @ 70°C, 1.5h ON / 0.5h OFF
Biased Humidity
ΔR ≤ ±(1.0% + 0.05Ω)
85°C, 85% RH, 1000h, 10% rated power
Solder Heat
ΔR ≤ ±(1.0% + 0.05Ω)
260±5°C, 10±1s
Solderability
≥95% wetting
245±3°C, 2±0.5s, Sn96.5/Ag3.0/Cu0.5
Board Flex / Bending
ΔR ≤ ±(1.0% + 0.05Ω)
3mm deflection
Rapid Temp Change
ΔR ≤ ±(0.5% + 0.05Ω)
−55°C / +155°C, 100 cycles
Anti-Sulfurized (H₂S)
ΔR ≤ ±(1.0% + 0.1Ω)
H₂S 3–5 ppm, 50 ± 2°C, 91–93% RH, 1000h
Anti-Sulfurized (ASTM B-809-95)
ΔR ≤ ±(1% + 0.05Ω)
Sulfur saturated vapor, 50 ± 2°C, 85–90% RH, 1000h