CL21A225KAFNNNG — Component Characterization

Capacitance
2.2µF
±10% (K)

Rated Voltage

25V

Dielectric

X5R

Class II

Temp Range

−55/+85°C

X5R rated

Insulation R

227MΩ

min @ 25V DC

Mouser

$0.019

In stock

Electrical Characteristics

Capacitance	2.2µF ±10% (K)
Rated Voltage	25V DC
Dielectric Type	X5R (Class II)
Dissipation Factor	≤10%
Insulation Resistance	227MΩ
Temp Coefficient	±15% (X5R)
Test Voltage	1.0 ± 0.2 Vrms
Test Frequency	1.0 kHz ± 10%
Dielectric Strength	250% rated (62V), 1–5s

Operating Conditions

Operating Temp	−55°C to +85°C
Storage Temp	−55°C to +125°C
Termination	Ni/Sn (lead-free)
Solder Compatibility	Sn-3.0Ag-0.5Cu
Mass	~0.021g

Package & Dimensions

Recommended Land Pattern

Pad Width	1.0mm
Pad-to-Pad (Reflow)	1.7 to 2.0mm
Pad Height	1.4mm
Solder Paste	100–150 µm

Impedance Behavior

Impedance vs. Frequency (characteristic for 2.2µF X5R)

SRF: Not specified in Samsung catalog. X5R dielectric shows higher ESR at elevated temperatures.

Reflow Soldering Profile

Standard Reflow Profile (Samsung CL21 Series)

Phase	Standard	Limit
Pre-heating	150–200°C, 60–120s	Same
Heating	Above 220°C, 30–60s	Above 230°C, 60s max
Peak Temperature	245°C ± 5°C	260°C, 10s
Cycles	2 times max

Environmental & Reliability

Adhesive Strength

No damage

10N (0805), 10s hold

Vibration

ΔC within ±5%

10–55Hz, 1.5mm amp, 6h total

Solderability

≥95% metallized

245 ± 5°C, 3 ± 0.3s dip

Bending Test

ΔC within ±10%

1mm deflection (0805)

Soldering Heat

ΔC within ±7.5%

270 ± 5°C, 10 ± 1s

Temperature Cycle

ΔC within ±7.5%

5 cycles, −55°C ↔ +85°C

Insulation Resistance

227MΩ min

25V DC, 25°C

Dielectric Strength