**Source:** [STMicroelectronics Datasheet (DS14161)](https://www.st.com/resource/en/datasheet/vl53l8cx.pdf)
**Manufacturer:** STMicroelectronics
**Part Number:** VL53L8CX
**Document:** DS14161 -- Rev 7, August 2023

## Description

The VL53L8CX is an 8x8 multizone Time-of-Flight (ToF) ranging sensor with low-power operation and enhanced distance ranging performance under ambient light. Based on STMicroelectronics' FlightSense technology, the sensor provides accurate ranging up to 400 cm with a 65-degree diagonal field of view.

The VL53L8CX integrates a new-generation VCSEL and two advanced metasurface lenses in an innovative "all in one" module. This enables high-performance use cases including low-power system activation, gesture recognition, SLAM for robotics, liquid level monitoring, and more.

Thanks to patented algorithms, the VL53L8CX can detect and track multiple targets within the FoV with a 64-zone depth measurement. STMicroelectronics' histograms ensure cover glass crosstalk immunity above 60 cm.

The VCSEL emits fully invisible 940 nm IR light with Class 1 laser safety certification (IEC 60825-1:2014). The sensor supports both SPI and I2C interfaces for high frequency frame rates and short boot times.

## Key Specifications

| Parameter | Value |
| --- | --- |
| Package | Optical LGA16 |
| Size | 6.4 x 3.0 x 1.75 mm |
| Ranging Distance | 2 to 400 cm per zone |
| AVDD Supply | 3.3 V |
| Core Supply (CORE_1V8) | 1.8 V |
| IOVDD Supply | 1.2 V or 1.8 V |
| Operating Temperature | -30 to 85 C |
| Sample Rate | Up to 60 Hz |
| Infrared Emitter | 940 nm VCSEL |
| I2C Interface | 1 MHz, address 0x52 |
| SPI Interface | Up to 3 MHz |
| Field of View (diagonal) | 65 degrees |
| Zone Resolution | 4x4 (16 zones) or 8x8 (64 zones) |
| Pin Count | 16 (LGA) |
| Typical Power (continuous) | 215 mW |
| Typical Power (autonomous, 1 Hz 4x4) | 1.6 mW |
| Laser Safety | Class 1 (IEC 60825-1:2014) |

## Features

- Multizone distance measurement with either 4x4 or 8x8 separate zones
- Autonomous low-power mode with interrupt programmable threshold to wake up the host
- Ranging up to 400 cm with enhanced performance under ambient light
- Multitarget detection and distance measurement in each zone
- Histogram processing and algorithmic compensation to minimize cover glass crosstalk
- Motion indicator for each zone showing if targets have moved and how
- Frame rate capability of 60 Hz
- New generation high-power 940 nm invisible light VCSEL with integrated analog driver
- 65-degree diagonal square FoV using DOEs on both transmitter and receiver
- Receiving array of SPADs (single photon avalanche diodes)
- Low-power microcontroller running firmware
- Single reflowable component with no additional optics required
- I2C (up to 1 MHz) or SPI (up to 3 MHz) interface
- Compatible with wide range of cover glass materials, can be hidden behind dark cover glass

## Pin Configuration

| Pin | Name | Type | Description |
| --- | --- | --- | --- |
| A1 | INT | I/O | Interrupt output, defaults to open drain (tristate), 47k pullup to IOVDD |
| A2 | LPn | Input | Low-power mode control; drive low to disable I2C in LP mode, high to enable |
| A3 | IOVDD | Power | 1.2 V or 1.8 V I/O supply |
| A4 | SDA / MOSI | I/O | I2C: bidirectional data, 2.2k pullup to IOVDD; SPI: main output secondary input |
| A5 | SCL / MCLK | Input | I2C: clock, 2.2k pullup to IOVDD; SPI: main clock |
| A6 | RSVD1 | Reserved | Connect to ground |
| A7 | RSVD2 | Reserved | Connect to ground |
| B1 | SYNC | I/O | General purpose I/O, defaults to open drain (tristate), 47k pullup to IOVDD |
| B4 | THERMALPAD | Ground | Connect to ground plane for thermal conduction |
| B7 | CORE_1V8 | Power | 1.8 V analog core supply |
| C1 | SPI_I2C_N | Input | I2C: low selects I2C mode, also serves as I2C reset pin; SPI: connect to IOVDD |
| C2 | NCS | Input | I2C: not used, connect to GND with 47k pulldown; SPI: active low chip select |
| C3 | GND | Ground | Ground |
| C4 | AVDD | Power | 3.3 V analog and VCSEL supply |
| C5 | MISO | Output | I2C: do not connect; SPI: main input secondary output, push-pull to IOVDD |
| C6 | RSVD3 | Reserved | Connect to ground |
| C7 | GND | Ground | Ground |

## Absolute Maximum Ratings

| Parameter | Min | Max | Unit |
| --- | --- | --- | --- |
| AVDD | -0.5 | 3.47 | V |
| CORE_1V8 | -0.5 | 1.98 | V |
| IOVDD | -0.5 | 1.98 | V |

## Recommended Operating Conditions

| Parameter | Min | Typ | Max | Unit |
| --- | --- | --- | --- | --- |
| AVDD supply | 3.13 | 3.3 | 3.47 | V |
| CORE_1V8 supply | 1.62 | 1.8 | 1.98 | V |
| IOVDD supply (1.2V config) | 1.08 | 1.2 | 1.32 | V |
| IOVDD supply (1.8V config) | 1.62 | 1.8 | 1.98 | V |
| Ambient temperature | -30 | -- | 85 | C |

## Electrical Characteristics

### Current Consumption

| Device State | AVDD Typ | AVDD Max | CORE_1V8 Typ | CORE_1V8 Max | IOVDD Typ | IOVDD Max | Unit |
| --- | --- | --- | --- | --- | --- | --- | --- |
| LP idle | 55 | 390 | 0.01 | 0.5 | 0.5 | 2 | uA |
| HP idle | 1 | 1.6 | 3 | 17 | 0.0003 | 0.002 | mA |
| Active ranging | 43 | 50 | 50 | 80 | 0.003 | 0.006 | mA |

### Typical Power Consumption

| Mode | Power | Unit |
| --- | --- | --- |
| Continuous (4x4 or 8x8) | 215 | mW |
| Autonomous 4x4, 1 Hz, 5 ms integration | 1.6 | mW |
| Autonomous 4x4, 5 Hz, 5 ms integration | 12.5 | mW |
| Autonomous 8x8, 1 Hz, 5 ms integration | 6.7 | mW |
| Autonomous 8x8, 5 Hz, 5 ms integration | 32.3 | mW |

### ESD Performance

| Parameter | Specification | Conditions |
| --- | --- | --- |
| Human body model | JEDEC JS-001-2014 | +/- 2 kV, 1500 ohm, 100 pF |
| Charged body model | JEDEC JS-001-2014 | +/- 500 V |

## Power Domains

The VL53L8CX requires three independent power supplies:

- **CORE_1V8:** 1.8 V analog core supply
- **AVDD:** 3.3 V analog and VCSEL supply
- **IOVDD:** 1.2 V or 1.8 V I/O supply (when 1.8 V, can share with CORE_1V8)

All three supplies should be applied and removed at the same time. Minimum slew rates must be met for proper power-on reset operation (AVDD: 0.001 V/us, CORE_1V8: 0.012 V/us, IOVDD: 0.012 V/us).

## Communication Interface

### I2C Interface

The I2C bus operates at up to 1 Mbit/s (fast mode plus) with a device 8-bit address of 0x52. Both SDA and SCL require pull-up resistors (2.2k ohm recommended). The interface supports autoincrement indexing with 16-bit register addresses.

### SPI Interface

The SPI interface operates at up to 3 MHz using 4-wire configuration (NCS, MCLK, MOSI, MISO). Clock polarity = 1, clock phase = 1 (data captured on rising edge, propagated on falling edge). Address length is 15 bits, data length is 8 bits. Supports autoincrement read and write modes.

## Software API

The host application controls the VL53L8CX through an API delivered as a C driver (and reference Linux driver). The driver provides high-level functions for device initialization, ranging start/stop, and mode select.

The device supports three power states:
- **LP idle:** Low-power idle with data retention, RAM and registers preserved
- **HP idle:** High-power idle, power-up state, required before starting ranging
- **Ranging:** Full operation with VCSEL actively pulsing

Transitions between states are controlled via I2C/SPI commands. Refer to UM3109 for detailed API usage.

## Applications

- Robotic applications: SLAM, wall tracking, small object detection, cliff prediction, floor recognition
- System activation under ambient light for smart buildings and smart lighting
- Content management for tanks, loads in trucks, and waste bins
- Liquid level monitoring
- Gesture recognition
- Keystone correction for video projectors
- Augmented reality/Virtual reality enhancement with dual camera stereoscopy
- IoT and battery-powered devices for user and object detection
- Laser assisted autofocus (LAF) for camera systems in low light or low contrast scenes

## Packages

| Order Code | Package | Packing | Min Order Qty |
| --- | --- | --- | --- |
| VL53L8CXV0GC/1 | Optical LGA16 with liner | Tape and reel | 3600 pcs |

### Package Details

- Body size: 6.4 x 3.0 x 1.75 mm
- 16-pin land grid array (LGA) with thermal pad
- Dual-source cap assemblies with identical pad and substrate design
- Product marking: L8A-
- Moisture sensitivity level: MSL 3 (IPC/JEDEC JSTD-020-C)
- Storage temperature: -40 to 90 C
- Maximum compression force: 25 N
- Reflow: Pb-free convection reflow only (no vapor phase), peak 240 C recommended / 260 C max

### Recommended Solder Profile

| Parameter | Recommended | Maximum | Unit |
| --- | --- | --- | --- |
| Min preheat temp | 130 | 150 | C |
| Max preheat temp | 200 | 200 | C |
| Preheat time | 90-110 | 60-120 | s |
| Liquidus temp | 217 | 217 | C |
| Time above liquidus | 55-65 | 55-65 | s |
| Peak temperature | 240 | 260 | C |
| Time to peak | 300 | 300 | s |
| Ramp down rate | -4 | -6 | C/s |