# TSSOP-14

The TSSOP-14 (Thin Shrink Small Outline Package) is a popular 14-pin IC package with 0.65mm pitch. At 4.4 x 5mm body size, it offers significant board space savings over SOIC while remaining hand-solderable. Commonly used for op-amps (LM324, TL074), logic ICs (74HC series), motor drivers, ADCs, and small MCU peripherals. The thin profile (1.1mm max height) makes it ideal for space-constrained designs.