# QFN-20-1EP

The QFN-20-1EP is a modern 20-pin Quad Flat No-lead package with an exposed thermal pad. The leadless design (4 x 4mm body, 0.5mm pitch) provides smaller footprint than equivalent leaded packages while offering superior thermal and electrical performance through the exposed pad. The 2.5 x 2.5mm thermal pad provides excellent heat dissipation. Used for sensor ICs, small microcontrollers, RF transceivers, and power management chips.