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Set visibility: public

Ray ·a45d514b47 ·1mo ago ·parent 17224f9
1 file changed +15−12
page.json+15−12
@@ -38,7 +38,7 @@         "number": "2",         "name": "IREF",         "type": "passive",-        "description": "CC loop compensation pin. Recommended RC network R=10 k\u03a9, C=10 nF to GND. Leave floating if the CC function is not used."+        "description": "CC loop compensation pin. Recommended RC network R=10 kΩ, C=10 nF to GND. Leave floating if the CC function is not used."       },       {         "number": "3",@@ -50,19 +50,19 @@         "number": "4",         "name": "CSP",         "type": "input",-        "description": "Main current-sense positive input, across the 10 m\u03a9 constant-current sense resistor R_S1. Tie to GND if unused; must not be left floating."+        "description": "Main current-sense positive input, across the 10 mΩ constant-current sense resistor R_S1. Tie to GND if unused; must not be left floating."       },       {         "number": "5",         "name": "ISP2",         "type": "input",-        "description": "Type-A2 port current-sense positive input, across the 5 m\u03a9 R_S2 sense resistor."+        "description": "Type-A2 port current-sense positive input, across the 5 mΩ R_S2 sense resistor."       },       {         "number": "6",         "name": "ISP3",         "type": "input",-        "description": "Type-A3 port current-sense positive input, across the 5 m\u03a9 R_S3 sense resistor."+        "description": "Type-A3 port current-sense positive input, across the 5 mΩ R_S3 sense resistor."       },       {         "number": "7",@@ -74,7 +74,7 @@         "number": "8",         "name": "LINK",         "type": "bidirectional",-        "description": "XPD-LINK inter-chip communication bus. Pull to GND through R_LINK = 10 k\u03a9. Used to coordinate multi-chip charger designs."+        "description": "XPD-LINK inter-chip communication bus. Pull to GND through R_LINK = 10 kΩ. Used to coordinate multi-chip charger designs."       },       {         "number": "9",@@ -146,13 +146,13 @@         "number": "20",         "name": "DP1",         "type": "bidirectional",-        "description": "USB Type-C port data line (labelled DP1 on package; datasheet description reads 'Type-C \u53e3\u6570\u636e\u7aef\u53e3 DM')."+        "description": "USB Type-C port data line (labelled DP1 on package; datasheet description reads 'Type-C 口数据端口 DM')."       },       {         "number": "21",         "name": "DM1",         "type": "bidirectional",-        "description": "USB Type-C port data line (labelled DM1 on package; datasheet description reads 'Type-A \u53e3\u6570\u636e\u7aef\u53e3 DP')."+        "description": "USB Type-C port data line (labelled DM1 on package; datasheet description reads 'Type-A 口数据端口 DP')."       },       {         "number": "22",@@ -164,7 +164,7 @@         "number": "23",         "name": "VBUS",         "type": "power_out",-        "description": "USB Type-C VBUS output rail. Pins 23/24/25 are internally tied - bulk decoupling C_VBUS 1-10 \u00b5F required. Rating: -0.3 to 26 V."+        "description": "USB Type-C VBUS output rail. Pins 23/24/25 are internally tied - bulk decoupling C_VBUS 1-10 µF required. Rating: -0.3 to 26 V."       },       {         "number": "24",@@ -176,7 +176,7 @@         "number": "25",         "name": "VBUS",         "type": "power_out",-        "description": "USB Type-C VBUS output rail (tied to pins 23 and 24). Internal 10 m\u03a9 VBUS switch and discharge path terminate here."+        "description": "USB Type-C VBUS output rail (tied to pins 23 and 24). Internal 10 mΩ VBUS switch and discharge path terminate here."       },       {         "number": "26",@@ -194,7 +194,7 @@         "number": "28",         "name": "VPWR",         "type": "power_in",-        "description": "Chip supply input. Operating range 3.3-21 V (abs max 26 V). Requires C_VPWR bulk cap 1-10 \u00b5F. Pins 28/29/30 are internally tied."+        "description": "Chip supply input. Operating range 3.3-21 V (abs max 26 V). Requires C_VPWR bulk cap 1-10 µF. Pins 28/29/30 are internally tied."       },       {         "number": "29",@@ -224,7 +224,7 @@         "number": "33",         "name": "EPAD",         "type": "power_in",-        "description": "Exposed thermal pad on the QFN underside - die ground. Must be soldered to the PCB GND plane for both electrical return and thermal dissipation (\u03b8JA = 34 \u00b0C/W)."+        "description": "Exposed thermal pad on the QFN underside - die ground. Must be soldered to the PCB GND plane for both electrical return and thermal dissipation (θJA = 34 °C/W)."       }     ],     "provenance": {@@ -288,5 +288,8 @@     "docs/xpd977d30a-datasheet.pdf",     "viewers/symbol.html",     "viewers/footprint.html"-  ]+  ],+  "visibility": {+    "public": true+  } }\ No newline at end of file