component
XPD720BP25
Public Made by Adomby adom
Shenzhen Fuman USB Converters, ESOP-8. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
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page.json+9−6@@ -32,7 +32,7 @@ "number": "1", "name": "VPWR", "type": "power_in",- "description": "Chip input supply, 3.6 V to 21 V typical (max 25 V abs). UVLO rising 3.3 V, falling 2.9 V. Requires ~10 \u00b5F (min 4.7 \u00b5F) decoupling to GND."+ "description": "Chip input supply, 3.6 V to 21 V typical (max 25 V abs). UVLO rising 3.3 V, falling 2.9 V. Requires ~10 µF (min 4.7 µF) decoupling to GND." }, { "number": "2",@@ -44,7 +44,7 @@ "number": "3", "name": "VFB", "type": "input",- "description": "Voltage regulation feedback input, connected to the front-end power supply feedback divider (typ. R_FB1 = 100 k\u03a9 upper, R_FB2 = 33 k\u03a9 lower). Sensed to close the CV loop and step VBUS across PDO/APDO levels."+ "description": "Voltage regulation feedback input, connected to the front-end power supply feedback divider (typ. R_FB1 = 100 kΩ upper, R_FB2 = 33 kΩ lower). Sensed to close the CV loop and step VBUS across PDO/APDO levels." }, { "number": "4",@@ -62,7 +62,7 @@ "number": "6", "name": "CC1", "type": "bidirectional",- "description": "Type-C Configuration Channel 1. Drives Rp source (330 \u00b5A for 3A advertisement, 180 \u00b5A for 1.5A), detects sink attach/orientation, and carries BMC-encoded USB PD 2.0/3.0 / PPS messaging. Includes over-voltage protection."+ "description": "Type-C Configuration Channel 1. Drives Rp source (330 µA for 3A advertisement, 180 µA for 1.5A), detects sink attach/orientation, and carries BMC-encoded USB PD 2.0/3.0 / PPS messaging. Includes over-voltage protection." }, { "number": "7",@@ -74,13 +74,13 @@ "number": "8", "name": "VBUS", "type": "power_out",- "description": "Type-C VBUS output. Internally connected via the integrated 10 m\u03a9 power MOSFET and 10 m\u03a9 current-sense resistor. Fast OVP trips at +20% of the target voltage, slow OVP at +15%. Requires optional 1 \u00b5F decoupling."+ "description": "Type-C VBUS output. Internally connected via the integrated 10 mΩ power MOSFET and 10 mΩ current-sense resistor. Fast OVP trips at +20% of the target voltage, slow OVP at +15%. Requires optional 1 µF decoupling." }, { "number": "9", "name": "GND", "type": "power_in",- "description": "Exposed thermal / power pad on the underside of the ESOP-8 package. Must be soldered to the PCB ground plane for both electrical ground reference and thermal dissipation (\u03b8JA = 42 \u00b0C/W)."+ "description": "Exposed thermal / power pad on the underside of the ESOP-8 package. Must be soldered to the PCB ground plane for both electrical ground reference and thermal dissipation (θJA = 42 °C/W)." } ], "provenance": {@@ -144,5 +144,8 @@ "docs/xpd720bp25-datasheet.pdf", "viewers/symbol.html", "viewers/footprint.html"- ]+ ],+ "visibility": {+ "public": true+ } }